An automated testing device for a semiconductor device

Abstract

The present invention relates to the technical field of semiconductor devices, in particular to an automatic testing device for semiconductor devices, which includes a chassis, a conduction component and a current output control component are arranged inside the upper side of the chassis, and a temperature measuring component is fixedly connected to one side of the chassis. A water tank is fixedly connected to the side of the case close to the temperature measuring box, a temperature conducting component is installed inside the water tank, a fixed component is fixedly installed inside the case, and a conduction component is fixedly installed inside the upper side of the case. Two electric push rods are fixedly installed inside the chassis, and the output ends of the two electric push rods are respectively fixedly connected with docking components, so that the user can adjust the two docking components by controlling the electric push rods, so that it can be used for refrigeration chips of different specifications. In the electrified docking operation, the first conductive rod is fixedly connected inside the fixed ring, so that the first conductive rod can be connected with the cooling sheet for conduction without frequent replacement of detection equipment.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to an automatic testing device for semiconductor devices. Background technique [0002] Refrigeration sheet is also called thermoelectric semiconductor refrigeration component, Peltier, etc. It refers to a patch that is divided into two sides, one side absorbs heat, the other side dissipates heat, and acts as a heat conduction patch. It can both cool and heat. The cooling efficiency is generally not high, but the heating efficiency is very high, which is always greater than 1. Therefore, one piece can replace the separate heating system and cooling system; [0003] However, in the factory production, there may be bad cooling chips, resulting in the effect of cooling or heating not reaching the intended effect, and the traditional semiconductor cooling chip is very cumbersome to detect, when faced with cooling chips of different sizes It may be necessary to replace tes...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an automatic testing device for semiconductor devices, which solves the problem that the traditional semiconductor refrigerating sheet is very cumbersome in testing during factory production, and it may need to be replaced when facing refrigerating sheets of different sizes. Problems with different specifications of test fixtures

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