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Method for removing quartz lens

A quartz lens and removal technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve problems such as inability to solve, poor brittleness of quartz lens, and unusable use.

Pending Publication Date: 2021-11-30
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When realizing high-stress silicon nitride film deposition, it is necessary to use light-enhanced chemical vapor deposition equipment to form light-enhanced films. When overhauling the reaction chamber of light-enhanced chemical vapor deposition equipment, it is necessary to replace the light source and the quartz lens, but the brittleness of the quartz lens is poor. During the transfer process, the quartz lens is easy to collide with the inner wall of the reaction chamber or other equipment, resulting in damage to the edge, so that it cannot be used continuously. There is no such method in the prior art. solutions to this technology

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  • Method for removing quartz lens

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Embodiment Construction

[0023] In order to make the purpose, advantages and features of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in very simplified form and not drawn to scale, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention. In addition, the structures shown in the drawings are often a part of the actual structure. In particular, each drawing needs to display different emphases, and sometimes uses different scales.

[0024] Light-enhanced chemical vapor deposition equipment can excite process gases under ultraviolet light and low temperature conditions (figure 1 It is a structural schematic diagram of a reaction chamber of a light-enhanced chemical vapor deposition equipment, such as figure 1 As shown, the reaction chamber 100 of the light-enhanced chemical va...

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Abstract

The invention provides a method for removing a quartz lens, the quartz lens is arranged in a reaction cavity, a light source is also arranged in the reaction cavity, and the light source is arranged above the quartz lens, and the method is characterized by comprising the following steps: taking the light source out of the reaction cavity; providing a protection cover, wherein the protection cover is a cavity with an opening in one end, a through hole is formed in the top face of the protection cover, the protection cover covers the quartz lens, and the through hole is exposed out of part of the top face of the quartz lens; and the exposed top surface of the quartz lens is adsorbed by using a vacuum chuck, so that the quartz lens is moved out of the reaction cavity, and the quartz lens is prevented from being damaged due to collision with external equipment in the moving process.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a method for removing a quartz lens. Background technique [0002] Because quartz lens has good mechanical properties, thermophysical properties, optical properties and chemical stability, and can transmit ultraviolet rays, it has been widely used in high temperature instruments and optical equipment. When realizing high-stress silicon nitride film deposition, it is necessary to use light-enhanced chemical vapor deposition equipment to form light-enhanced films. When overhauling the reaction chamber of light-enhanced chemical vapor deposition equipment, it is necessary to replace the light source and the quartz lens, but the brittleness of the quartz lens is poor. During the transfer process, the quartz lens is easy to collide with the inner wall of the reaction chamber or other equipment, resulting in damage to the edge, so that it cannot be used continuously. There is no such meth...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/48
CPCC23C16/48
Inventor 朱祝司龚荟卓
Owner SHANGHAI HUALI MICROELECTRONICS CORP