Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor

A technology of ceramic capacitors and capacitors, applied in the direction of capacitor manufacturing, multilayer capacitors, fixed capacitor electrodes, etc., can solve problems such as cracks in the capacitor body, and achieve the effect of reducing stress concentration

Pending Publication Date: 2022-06-24
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, if stress due to bending or the like is applied to the board on which the multilayer ceramic capacitor is mounted, the end of the interposer will press the capacitor body, and the stress will concentrate on the contact portion, which may cause cracks in the capacitor body

Method used

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  • Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor
  • Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor
  • Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor

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no. 1 Embodiment approach

[0060] First, the multilayer ceramic capacitor 1 according to the first embodiment of the present invention will be described. figure 1 It is a schematic perspective view of the multilayer ceramic capacitor 1 of the first embodiment. figure 2 It is along the lines of the multilayer ceramic capacitor 1 of the first embodiment. figure 1 Sectional view of line II-II in . image 3 It is along the lines of the multilayer ceramic capacitor 1 of the first embodiment. figure 1 Sectional view of line III-III in .

[0061] The multilayer ceramic capacitor 1 includes: a capacitor body 1A having a substantially rectangular parallelepiped shape including a laminated body 2 and a pair of external electrodes 3 provided at both ends of the laminated body 2; an interposer 4 attached to the capacitor body 1A; and an insulating resin film 50 . Further, the laminate 2 includes an inner layer portion 11 including a plurality of sets of dielectric layers 14 and internal electrode layers 15 . ...

no. 2 Embodiment approach

[0141] Next, the multilayer ceramic capacitor 200 according to the second embodiment of the present invention will be described. Figure 7 is the same as that of the first embodiment figure 2 Corresponding cross-sectional view of the multilayer ceramic capacitor 200 according to the second embodiment.

[0142] The multilayer ceramic capacitor 200 of the second embodiment is different from that of the first embodiment in that the insulating resin film 50 is the same as that of the first embodiment, and the description thereof is omitted.

[0143] The insulating resin film 50 according to the second embodiment includes: an insulating resin film 50A, which is arranged in the gap DA on the side of the first interposer 4A, and extends slightly from the gap DA to the center portion side in the longitudinal direction L; and an insulating resin film 50B, which is arranged in the gap DA. The gap DB on the side of the second interposer 4B slightly extends from the gap DB to the center...

no. 3 Embodiment approach

[0147] Next, the multilayer ceramic capacitor 300 according to the third embodiment of the present invention will be described. Figure 8 is the same as that of the first embodiment figure 2 Corresponding cross-sectional view of the multilayer ceramic capacitor 300 of the third embodiment.

[0148] The multilayer ceramic capacitor 300 of the third embodiment is different from that of the first embodiment in that the insulating resin film 50 is the same as that of the first embodiment, so the description is omitted.

[0149] Regarding the insulating resin film 50 , the insulating resin film 50 of the third embodiment has a portion arranged in the gap DA on the side of the first interposer 4A and a gap DB arranged on the side of the second interposer 4B, as in the first embodiment. The part that connects the gap DA and the gap DB is the same as the first embodiment in this point.

[0150] However, in the insulating resin film 50 of the third embodiment, the thickness of the p...

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Abstract

The invention provides a laminated ceramic capacitor and a method for manufacturing the laminated ceramic capacitor, which can reduce stress concentration on a capacitor main body caused by contact with an interposer. A multilayer ceramic capacitor (1) according to the present invention is provided with: a capacitor body (1A) having a multilayer body (2) in which dielectric layers (14) and internal electrode layers (15) are alternately laminated, and external electrodes (3) that are respectively arranged on both end surfaces of the multilayer body (2) and are connected to the internal electrode layers (15); an interposer (4) disposed on a substrate mounting side surface (AC2) of the capacitor body (1A); and an insulating resin film (50) disposed in a gap between the substrate mounting side surface (AC2) and a capacitor facing surface (AI) of the interposer (4), the capacitor facing surface (AI) facing the substrate mounting side surface (AC2).

Description

technical field [0001] The present invention relates to a laminated ceramic capacitor and a method for manufacturing the laminated ceramic capacitor. Background technique [0002] In recent years, large-capacitance and compact multilayer ceramic capacitors have been demanded. Such a multilayer ceramic capacitor has an inner layer portion in which a dielectric layer, which is a ferroelectric material having a relatively high permittivity, and an internal electrode are alternately stacked. [0003] Then, a dielectric layer serving as an outer layer portion is disposed on the upper and lower portions of the inner layer portion to form a rectangular parallelepiped laminate, and external electrodes are provided on both end surfaces in the longitudinal direction of the laminate to form a capacitor body. [0004] Furthermore, in order to suppress the occurrence of so-called "squealing", a multilayer ceramic capacitor is known (see Patent Document 1) including an interposer arrange...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/12H01G4/002H01G2/06
CPCH01G4/30H01G4/12H01G4/002H01G2/06H01G2/065H01G4/008H01G4/012H01G4/1209H01G4/1227H01G4/232H01G13/00Y02E60/13H01G4/248
Inventor 筑摩忍
Owner MURATA MFG CO LTD
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