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Light emitting diode packaging structure convenient to recycle

A technology of light-emitting diodes and packaging structures, which is applied to semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, and light sources. The effect of improving the service life and avoiding failure

Pending Publication Date: 2022-07-26
江苏固得沃克微电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a light-emitting diode package structure that is easy to recycle, which solves the problem that the existing light-emitting diode needs to be replaced as a whole after it fails, and the package cannot be recycled after being scrapped. problem of use

Method used

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  • Light emitting diode packaging structure convenient to recycle
  • Light emitting diode packaging structure convenient to recycle
  • Light emitting diode packaging structure convenient to recycle

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Embodiment Construction

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] see Figure 1-4 , the present invention provides a technical solution: a light-emitting diode package structure that is easy to recycle, including a base 1 and a package 2, a light-emitting chip 3 is arranged on the top of the base 1, and both sides of the light-emitting chip 3 are provided with lead Pin 4, the bottom end of pin 4 penetrates through base 1 and extends to its bottom;

[0025] The inside of the package 2 is prov...

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Abstract

The invention discloses a light-emitting diode packaging structure convenient to recycle, which comprises a base and a packaging piece, a light-emitting chip is arranged at the top of the base, pins are arranged on the two sides of the light-emitting chip, the bottom ends of the pins penetrate through the base and extend to the bottom of the base, a slow heating layer is arranged in the packaging piece, and the slow heating layer is arranged in the packaging piece. A fluorescent layer is arranged at the top of the slow heating layer, an outer sealing layer is arranged at the top of the fluorescent layer, mounting shafts are fixedly connected to the two sides of the bottom of the packaging piece, clamping holes are formed in one sides of the mounting shafts, mounting holes are formed in the two sides of the top of the base and matched with the mounting shafts, and the mounting shafts are made of metal materials; and the bottom of the inner wall of the mounting hole is fixedly connected with a magnetic block. The light-emitting diode packaging structure convenient to recycle solves the problems that an existing light-emitting diode needs to be integrally replaced after a fault occurs, and a packaging body cannot be recycled after the existing light-emitting diode is scrapped.

Description

technical field [0001] The invention relates to the technical field of light-emitting diodes, in particular to a light-emitting diode packaging structure that is easy to recycle. Background technique [0002] Light-emitting diodes are semiconductor devices that convert electrical energy into light energy. Because light-emitting diodes have the advantages of long life, small size, high shock resistance, low heat generation and low power consumption, light-emitting diodes have been widely used in home appliances and various Therefore, light-emitting diodes have broad market prospects. [0003] Existing light-emitting diodes generally cannot be disassembled after being packaged, and the whole needs to be replaced after a fault occurs, and the existing light-emitting diodes cannot be recycled after being scrapped, which does not conform to the concept of environmental protection. SUMMARY OF THE INVENTION [0004] In view of the deficiencies of the prior art, the present inven...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/20F21K9/64F21V29/83F21V29/74F21V29/503F21Y115/10
CPCF21K9/20F21K9/64F21V29/83F21V29/74F21V29/503F21Y2115/10
Inventor 苏荻楠
Owner 江苏固得沃克微电子科技有限公司
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