Manufacturing method and structure of electroplated nickel/gold for electric contact pad of chip package substrate
An electrical contact pad, chip packaging technology, applied in the direction of printed circuits connected with non-printed electrical components, the formation of electrical connection of printed components, semiconductor/solid-state device manufacturing, etc. The problems of adhesion, the influence of the electrical coupling structure of the gold wire and the bonding pad, etc., can achieve the effect of increasing the wiring area of the conductive line, reducing the wiring area of the electroplating wire, and avoiding the quality of the electrical connection.
Inactive Publication Date: 2005-08-24
PHOENIX PRECISION TECH CORP
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Problems solved by technology
Though this technology needn't lay electroplating wire in addition, the upper surface of the whole circuit layer 25 (comprising electrical contact pad 26 and all conductive circuits) of substrate 2 has covered a nickel / gold layer, because nickel / gold raw material is quite expensive, This method obviously wastes a lot of manufacturing cost; in addition, the electrical contact pad 26 of this method is a part of the circuit layer 25, and the material of the electrical contact pad is metallic copper, and only the nickel / gold layer 23 is covered on its upper surface, There are still other parts, including the electrical contact pads, which are exposed on both sides of the bonding pads, and are not covered with nickel / gold layer. Therefore, it is easy to have insufficient gold surface or be eroded and oxidized by the outside world. Gold is used on the substrate for chip packaging When the wire is connected, the electrical coupling structure between the gold wire and the pad is easily affected; in addition, the nickel / gold layer 23 covered on the surface of the conductive circuit of the circuit layer 25 and the solder resist layer 27 covering the surface of the substrate are different due to their material properties. And can not achieve a stable close, easy to cause poor reliability defects
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[0028] The invention relates to an electroplating nickel / gold manufacturing method and structure of an electrical contact pad of a chip packaging substrate. Figure 3A to Figure 3H It is a schematic diagram of the nickel / gold electroplating manufacturing method and structure of the electrical contact pad of the chip package substrate according to the embodiment of the present invention.
[0029] First, a single-layer or multi-layer substrate 100 is provided, and the substrate 100 has completed the required front-end manufacturing process, such as a number of via holes (PTH) or blind vias (Blind via), etc. have been formed therein, and are processed by lithography, By means of etching or the like, the circuit layer 105 defined by patterning the circuit is formed on the substrate 100, such as Figure 3A shown.
[0030] Next, if Figure 3B As shown, a conductive film 110 (ConductiveFilm) is covered on the surface of the substrate 100. The conductive film 110 is mainly used as a...
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An electric contact pad on the chip-packing substrate features that said electric contact pad is fully covered by a Ni / Au layer and the substrate has not other electroplated conductors. Its preparingprocess includes such steps as refining circuit layer on substrate by circuit pattern, covering an electric conducting film, generating a photoresist layer to cover the substrate (said photoresist layer has window to expose out the circuit layer as electric contact pad region), removing the uncovered electric conducting film, generating another photoresist layer to cover the electric conducting film exposed by said hole, electroplating Ni / Au to the electric contact pad, and removing photoresist layer and electric conducting film.
Description
technical field [0001] The invention relates to an electroplating nickel / gold manufacturing method and structure of an electrical contact pad, in particular to an electroplating nickel / gold manufacturing method and structure of a semiconductor chip packaging substrate electrical contact pad. Background technique [0002] The technology related to the electronics industry is developing rapidly. With the trend of miniaturization of electronic products, manufacturers of semiconductor chip packaging substrates (or IC substrates) are also facing many key issues in manufacturing methods. For example, a number of electrical contact pads extending from conductive lines are to be formed on the surface of the substrate, as an integral part of electronic signal or power transmission, usually on the upper surface of the electrical contact pads, a nickel / gold (Ni / Au) layer, such as the bonding pad (or gold finger, Bonding Finger) of the semiconductor chip packaging substrate, that is, a ...
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IPC IPC(8): H01L21/48H01L21/60H01L23/14H01L23/48H05K1/18H05K3/40
CPCH01L2924/0002
Inventor许诗滨陈江都刘彦宏
OwnerPHOENIX PRECISION TECH CORP