Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

a technology of electronic features and precursor compositions, applied in the field of precursor compositions, can solve the problems of inadequate approaches to produce well-defined features with good electrical properties, low viscosity of formulations, and inability to use alternative deposition methods

Inactive Publication Date: 2007-05-10
CABOT CORP
View PDF10 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this latter family of low viscosity compositions is not as well developed as the high viscosity compositions.
Ink-jet printing of conductors has been explored, but the approaches to date have been inadequate for producing well-defined features with good electrical properties.
However, the formulations have a relatively high viscosity and are not useful for alternative deposition methods such as ink-jet printing.
However, the deposits were chosen for optical properties and were either not conductive or were poorly conductive.
However, the printing of these compositions is not disclosed in detail.
However, formulations for depositing electronic features are not disclosed.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low viscosity precursor compositions and methods for the deposition of conductive electronic features
  • Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Examples

Experimental program
Comparison scheme
Effect test

example 1

Comparative Example

[0321] A silver metal precursor composition containing 50 grams Ag-trifluoroacetate and 50 grams H2O was formulated. The calculated silver content of the precursor composition was 24.4 wt. % and thermogravimetric analysis showed the mass loss reached 78 wt. % at 340° C. This data corresponds to the above-described decomposition temperature for pure Ag-trifluoroacetate, within a reasonable margin for error.

example 2

Preferred Additive

[0322] A silver precursor composition was formulated containing 44 grams Ag-trifluoroacetate, 22 grams H2O, 33 grams DEGBE and 1 gram lactic acid. The calculated silver content was 21.5 wt. % and thermogravimetric analysis showed the mass loss reached 79 wt. % at 215EC. The addition of DEGBE as a conversion reaction inducing agent advantageously reduced the conversion temperature by 125EC compared to the formulation described in Example 1, a decrease of about 34 percent compared to pure Ag-trifluoracetate. The lactic acid functions as a crystallization inhibitor.

example 3

Comparative Example

[0323] A silver precursor composition was formulated containing 58 grams Ag-trifluoroacetate and 42 grams dimethylformamide. The calculated silver content was 21.5 wt. % and thermogravimetric analysis showed a mass loss of 78.5 wt. % at 335EC, a conversion temperature similar to the formulation in Example 1. This example illustrates that a common solvent (dimethylformamide) had no affect on the conversion temperature of the composition.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
droplet sizeaaaaaaaaaa
droplet sizeaaaaaaaaaa
feature sizeaaaaaaaaaa
Login to View More

Abstract

A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation application of co-pending U.S. patent application Ser. No. 10 / 265,351, filed Oct. 4, 2002, which claims the benefit of U.S. Provisional Application No. 60 / 327,620 filed Oct. 5, 2001. Each of the foregoing referenced patent applications is incorporated by reference herein as if set forth below in its entirety.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to precursor compositions that are useful for the deposition of conductive electronic features. The precursor compositions can advantageously have a low conversion temperature to enable low-temperature treatment of the precursors to form conductive electronic features on a variety of substrates. The precursor compositions can also have a low viscosity to enable the deposition of the compositions using direct-write tools, such as ink-jet devices. [0004] 2. Description of Related Art [0005] The electroni...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B05D5/00B05D3/02C23C18/06C23C18/08H01B1/02H05K3/10
CPCC23C18/06C23C18/08H01B1/026H05K3/105H01L24/03H01L24/05H01L2224/05294H01L2224/053H01L2924/12042H01L2924/12044H01L2924/14H05K1/097H05K2201/0154H05K2203/1131H01L2924/00
Inventor KODAS, TOIVO T.HAMPDEN-SMITH, MARK J.VANHEUSDEN, KARELDENHAM, HUGHSTUMP, AARON D.SCHULT, ALLEN B.ATANASSOVA, PAOLINAKUNZE, KLAUS
Owner CABOT CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com