Transfer chamber for cluster system

a technology of cluster system and transfer chamber, which is applied in the direction of instruments, charge manipulation, furniture, etc., can solve the problems of difficult assembly of large transfer chamber as one body with other chambers, increased manufacturing costs, and difficult transportation of chambers, etc., and achieves easy setup or transportation, and manufacturing at a low cost

Inactive Publication Date: 2008-02-07
JUSUNG ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This design allows for the efficient handling of large substrates, reduces manufacturing costs, and simplifies the setup and transportation of the cluster system, while maintaining a secure and sealed environment for substrate transfer.

Problems solved by technology

However, since the transfer chamber is made of aluminum or stainless steel, it is difficult to manufacture the large transfer chamber as one body with other chambers.
In addition, although the large transfer chamber is manufactured as one body with other chambers, there are disadvantages that manufacturing costs is increased and it is not easy to transport the chambers.

Method used

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  • Transfer chamber for cluster system
  • Transfer chamber for cluster system
  • Transfer chamber for cluster system

Examples

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Embodiment Construction

[0029] Reference will now be made in detail to the illustrated embodiments of the present invention, the examples of which are illustrated in the accompanying drawings.

[0030]FIG. 3 is a schematic view of a transfer chamber according to a first embodiment of the present invention and FIG. 4 is a schematic exploded view of the transfer chamber. The transfer chamber of the first embodiment may be connected to one loadlock chamber and five processing chambers.

[0031] In FIGS. 3 and 4, the transfer chamber 300 includes a first body 320, a cover 380, a second body 340 and a third body 360. The cover 380 is combined with an upper portion of the first body 320 in the context of the figure. The second and third bodies 340 and 360 are joined with sides of the first body 320 facing each other. O-rings 330, 350 and 370 are interposed between the first body 320 and the cover 380 and between the first body 320 and the second and third bodies 340 and 360 for sealing.

[0032] The first body 320 has...

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Abstract

A transfer chamber for a cluster system includes a first body, a second body attached at one side of the first body, and a cover combined with an upper portion of the first body. The transfer chamber further includes a third body at another side of the first body, wherein the third body has the same shape as the second body.

Description

[0001] This application is a continuation of U.S. patent application Ser. No. 10 / 859,893, filed Jun. 2, 2004, now pending and claims the benefit of Korean Patent Application No. 2003-0035350, filed in Korea on Jun. 2, 2003, which is hereby incorporated by reference.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to an apparatus of manufacturing a semiconductor device, and more particularly, to a transfer chamber for a cluster system of manufacturing a semiconductor device. [0004] 2. Discussion of the Related Art [0005] Due to rapid development in information technology, display devices have evolved to process and display increasingly large amounts of information. Flat panel display technologies have been recently conceived and developed for display devices having small thickness, light weight, and low power consumption. Among these technologies, a liquid crystal display (LCD) device has been spotlight as a substitution for a cathode ...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): C23C16/56B65G49/07H01L21/677G02F1/13H01L21/00
CPCY10T29/41H01L21/67196G02F1/13
InventorJANG, GEUN-HA
OwnerJUSUNG ENG