Electronic module, method of manufacturing connector, and method of manufacturing electronic module
Active Publication Date: 2020-08-27
SHINDENGEN ELECTRIC MFG CO LTD
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Abstract
Description
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The present invention is about a connector design that allows for better heat dissipation between electronic components. One aspect of this design is a frequent use of columns to separate components. Additionally, a new aspect was introduced by adding a groove to the connector's head part to prevent the spread of a conductive adhesive agent. These features help improve the overall performance and reliability of the connector.
Problems solved by technology
Such a connector is provided in one side of the first electronic element and hence may cause imbalance.
If the connector causes imbalance in this manner, the conductive adhesive agent sometimes flows out from the one-side surface of the connector.
Adopting an aspect in which the second electronic element is provided for the connector provided for the first electronic element tends to cause confinement of heat.
Method used
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first embodiment
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[0052]In this embodiment, “one side” indicates the upper side of FIG. 1, and “another side” indicates the lower side of FIG. 1. The up / down direction in FIG. 1 is called the “first direction”, the right / left direction is called the “second direction”, and the obverse / reverse direction of the drawing surface is called the “third direction”. The in-planar direction including the second and third directions is called a “planar direction”, and a view from one side is called a “planar view”.
[0054]As shown in FIG. 1, the first electronic unit may have a first substrate 11, a plurality of first conductive layers 12 provided in one side of the first substrate 11, and a first electronic element 13 provided one side of the first conductive layers 12. The first electronic element 13 may be a switching element or control element. When the first electronic element 13 is a switch...
second embodiment
[0103]The second embodiment of the present invention will be described next.
[0104]The first embodiment has exemplified the aspect in which the first groove part 64 is provided at the boundary between the first inclined surface 68 and the first flat surface 69, and the second groove part 74 is provided at the boundary between the second inclined surface 78 and the second flat surface 79. However, in the present embodiment, as shown in FIGS. 10 to 12, a first groove part 64 is provided outside the circumference of a first concave part 67 and is provided in a first flat surface 69, and a second groove part 74 is provided outside the circumference of a second concave part 77 and is provided in a second flat surface 79. The other constituent elements are the same as those of the first embodiment, and any aspects described in the first embodiment can be adopted. The same reference numerals denote the same members as those described in the first embodiment.
[0105]As in this embodiment, in o...
third embodiment
[0108]The third embodiment of the present invention will be described next.
[0109]Unlike in the first and second embodiments, in the present embodiment, a first groove part 64 is provided in a first inclined surface 68, and a second groove part 74 is provided in a second inclined surface 78. With regard to other constituent elements, any aspects described in the respective embodiments can be adopted. The same reference numerals denote the same members as those described in the respective embodiments.
[0110]As in the present embodiment, adopting the aspect in which the first groove part 64 is provided in the first inclined surface 68 is beneficial in terms of preventing, per se, a conductive adhesive agent from flowing out from a first concave part 67. Likewise, adopting the aspect in which the second groove part 74 is provided in the second inclined surface 78 is beneficial in terms of preventing, per se, a conductive adhesive agent from flowing out from a second concave part 77.
[0111...
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PUM
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Abstract
An electronic module has a first electronic element 13, a first connector 60 provided in one side of the first electronic element 13, and having a first columnar part 62 extending to another side and a first groove part 64 provided in a one-side surface, and a second electronic element 23 provided in one side of the first connector 60 via a conductive adhesive agent provided inside a circumference of the first groove part 64. The first connector 60 has a first concave part 67 on one side at a position corresponding to the first columnar part 62.
Description
TECHNICAL FIELD[0001]The present invention relates to an electronic module having a connector, a method of manufacturing a connector, and a method of manufacturing an electronic module.BACKGROUND ART[0002]An electronic module having a plurality of electronic elements provided in a sealing resin has been conventionally known (see, for example, JP 2014-45157 A). Such electronic modules are desired to be downsized.[0003]As a means for downsizing, an aspect is conceivable, in which electronic elements are stacked in a layered state. In this case, a connector may be provided in one side (for example, the obverse surface side) of an electronic element (first electronic element), and another electronic element (second electronic element) may be provided in one side of the connector via a conductive adhesive agent such as solder.[0004]Such a connector is provided in one side of the first electronic element and hence may cause imbalance. If the connector causes imbalance in this manner, the ...
Claims
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Application Information
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