The utility model belongs to but is not limited to the field of
semiconductor device packaging technology discloses a gravity type double -sided insulation
test fixture for
semiconductor package, and is used in cooperation with golden finger and test piece, including upper double -sided insulation
test suite and lower double -sided insulation
test suite, the upper double -sided insulation
test suite includes fixed base, fixed PEEK material track on the fixed base, is provided with
copper pole in PEEK material track inside, and
copper pole lead -out terminal passes through PEEK material track, and the
fixed bearing is fixed on PEEK material track through locating block, the lower double -sided insulation test suite includes the
ceramic track of installing on test seat, and is provided with
copper pole in
ceramic track middle. The utility model can satisfy the double -sided insulation test of DIP direct -insert type
semiconductor package form, has reliable stability and the convenience of operation, improves the equipment productivity, increases the accuracy of product parameter, strengthens the equipment stability, thereby spares maintenance cost.