1results about How to "Compact processing" patented technology

The application discloses a cover plate pressing device and a semiconductor process equipment. The cover plate pressing device comprises a fixing base which can be fixed to a process chamber, a telescopic cylinder, a supporting shaft and a pressing piece. The telescopic cylinder comprises a cylinder body and a telescopic shaft. The connecting end of the telescopic shaft is sealingly and movably connected with the inner wall of the cylinder body. The cylinder body is fixedly arranged on the fixing base. The cylinder body is provided with a first gas connection port and a second gas connection port. The first gas connection port is arranged on one side of the connecting end. The second gas connection port is arranged on the other side of the connecting end. The supporting shaft is fixed to the fixing base. The pressing piece comprises two opposite ends. The first end of the pressing piece is rotatably connected with the telescopic shaft of the telescopic cylinder. The second end of the pressing piece can be tightly matched with a cover plate. The pressing piece is further provided with a movable groove which extends along the direction of the two opposite ends. The supporting shaft extends into the movable groove along the direction perpendicular to the axial direction of the telescopic shaft. The supporting shaft is rotatably and slidably matched with the movable groove. The technical scheme can simplify the operation process of opening and closing the cover plate.