The present invention discloses a GaN HEMT device for improving
linearity and a preparation method thereof, the device comprising: a substrate layer; a GaN buffer layer, arranged on the substrate layer; a back-to-back
barrier layer, arranged on the GaN buffer layer, the Al component in the back-to-back
barrier layer increasing from x to y from top to bottom and then decreasing from y to 0; a source
electrode and a drain
electrode, the partial depths of the source
electrode and the drain electrode being respectively located inside the two ends of the GaN buffer layer; a
passivation layer, the
passivation layer being arranged on the back-to-back
barrier layer; and a gate electrode, the gate electrode being arranged on the back-to-back barrier layer in the gate electrode region. The new type of gradually changing barrier GaN HEMT device provided by the present invention has significantly improved
transconductance flatness compared with conventional structures, and the
linearity is improved. In addition, compared with a single gradually changing Al component barrier structure, the distribution of the
electric field under the gate of the new structure is flatter. Therefore, this structure takes into account good frequency characteristics, breakdown characteristics and excellent
linearity.