Circuit module having interleaved groups of circuit chips

Abstract

A circuit module has a carrier (10) and multiple stacks (20, 22) of circuit chips (24, 26) arranged on a surface (12, 14) of the carrier (10). Each stack has multiple circuit chips arranged in different layers (50, 52, 54, 56). The circuit chips are grouped in different groups, wherein the groups are not active at the same time. The circuit chips are arranged such that circuit chips belonging to the same group are arranged in different layers in adjacent stacks.

Description

technical field [0001] The present invention relates to a circuit module, and more particularly, to a circuit module contained in a carrier and a circuit chip set disposed on the carrier, wherein the circuit chips are classified into different groups driven at different times. Background technique [0002] The traditional structure of the memory module, DIMMs (dual in-line memory module, Dual In-LineMemory Module), for example, includes a module board (module board) and, for example, the memory chip, DRAM configured on the module board groups of chips. In a high-density memory module, the memory chips are stacked on the module board, wherein each stack includes a plurality of memory chips stacked on top of each other, typically, each stack includes two chips, one configured in a first layer of the stack, and one is disposed in a second layer of the stack. [0003] And in such conventional memory modules, the memory chips are classified into two memory chip groups (banks), ...

AI Technical Summary

Problems solved by technology

The arrangement of the memory chips as explained above, in which the memory chips belonging to the same memory group are arranged in the same layer, so heat dissipation is difficult

So, the temperature of the memory module can reach 80 to 90°C, especially, if the bottom chipset drives, the heat convection to the surrounding air is quite bad, and this may cause damage to the memory chips, and thus the memory module's damage

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