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Multi-chip package

A multi-chip packaging and chip technology, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., and can solve problems such as changes in circuit characteristics

Inactive Publication Date: 2009-04-15
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, it can be seen from this that if the semiconductor chip 101 with the circuit characteristics of the analog circuit 103 adjusted is packaged and sealed with molding resin at the wafer stage, the circuit characteristics adjusted at the wafer stage will change.

Method used

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Embodiment Construction

[0027] figure 1 A plan view showing the semiconductor multi-chip package of the first embodiment of the present invention, figure 2 Means figure 1 A-A cross-sectional view of the semiconductor multi-chip package of. A digital circuit 2 and an analog circuit 3 are formed on the semiconductor chip 1. In addition, on the semiconductor chip 1, a nonvolatile register 4 is also formed to store information for adjusting the circuit characteristics of the analog circuit 3. Based on the information stored in the nonvolatile register 4, the circuit characteristics of the analog circuit 3 are adjusted. The digital circuit 2, the analog circuit 3, and the nonvolatile register 4 are coated with an insulating film.

[0028] The present embodiment is characterized in that a multi-chip package in which other semiconductor dummy chips 11 are mounted via an adhesive 12 so as to overlap with the circuit area of ​​the analog circuit 3 whose circuit characteristics are adjusted by a nonvolatile re...

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Abstract

A multi-chip package suppresses a change, which is caused by packaging, of a circuit characteristic of an analog circuit of which characteristic is adjusted by a nonvolatile register. A digital circuit and an analog circuit are formed on a semiconductor chip. A nonvolatile register is also formed on the semiconductor chip to store information to adjust a circuit characteristic of the analog circuit. The circuit characteristic of the analog circuit is adjusted according to the information stored in this nonvolatile register. Then, another dummy semiconductor chip is attached with an adhesive being superimposed on a circuit area of the analog circuit to build a multi-chip package.

Description

Technical field [0001] The present invention relates to the stability of the characteristics of an analog circuit formed on a semiconductor chip. Background technique [0002] Nowadays, semiconductor chips are often mixed with analog circuits and digital circuits. The so-called analog circuit refers to a general term for circuits that use signals of analog values ​​as data, and includes, for example, a reference voltage generating circuit, a phase locked loop (PLL), an analog / digital conversion circuit, a digital / analog conversion circuit, and a phase comparison circuit. The so-called digital circuit refers to a general term for circuits that use signals of digital values ​​as data, and includes arithmetic circuits or memories composed of various logic circuits. [0003] Generally, digital circuits process digital signals, so that they have strong anti-noise ability and can perform actions with weak signals, so they are high-speed and low-power consumption. On the other hand, an ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/00H01L25/065
CPCH01L2924/14H01L25/18H01L2224/48145H01L24/48H01L2224/48091H01L25/0657H01L2225/06506H01L23/16H01L2225/06527H01L2224/451H01L2924/00014H01L24/45H01L2224/05554H01L2224/73265H01L2924/10162H01L24/49H01L2224/49175H01L2924/00H01L2224/45099H01L2224/05599H01L2924/00012
Inventor 竹泽良典长谷川和弘浅野隆浩中田崇司
Owner SANYO ELECTRIC CO LTD