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Multi-chip package

A multi-chip packaging and chip technology, which is applied in the fields of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., and can solve problems such as changes in circuit characteristics

Inactive Publication Date: 2007-09-12
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, it can be seen from this that if the semiconductor chip 101 with the circuit characteristics of the analog circuit 103 adjusted is packaged and sealed with molding resin at the wafer stage, the circuit characteristics adjusted at the wafer stage will change.

Method used

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Embodiment Construction

[0027] FIG. 1 is a plan view of a semiconductor multi-chip package according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the semiconductor multi-chip package of FIG. 1 along line A-A. A digital circuit 2 and an analog circuit 3 are formed on a semiconductor chip 1 . Also, on the semiconductor chip 1 , a nonvolatile register 4 is formed to hold information for adjusting circuit characteristics of the analog circuit 3 . Based on the information stored in the nonvolatile register 4, the circuit characteristics of the analog circuit 3 are adjusted. An insulating film is applied on the digital circuit 2 , the analog circuit 3 and the nonvolatile register 4 .

[0028] The present embodiment is characterized in a multi-chip package in which another semiconductor dummy chip 11 is mounted via an adhesive 12 so as to overlap the circuit region of the analog circuit 3 whose circuit characteristics are adjusted by nonvolatile registers. The se...

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Abstract

A multi-chip package suppresses a change, which is caused by packaging, of a circuit characteristic of an analog circuit of which characteristic is adjusted by a nonvolatile register. A digital circuit and an analog circuit are formed on a semiconductor chip. A nonvolatile register is also formed on the semiconductor chip to store information to adjust a circuit characteristic of the analog circuit. The circuit characteristic of the analog circuit is adjusted according to the information stored in this nonvolatile register. Then, another dummy semiconductor chip is attached with an adhesive being superimposed on a circuit area of the analog circuit to build a multi-chip package.

Description

technical field [0001] The present invention relates to the stabilization of the characteristics of an analog circuit formed on a semiconductor chip. Background technique [0002] Today, semiconductor chips are often mixed with analog circuits and digital circuits. The so-called analog circuit is a general term for circuits that use analog-valued signals as data, including, for example, a reference voltage generation circuit, a phase-locked loop (PLL), an analog / digital conversion circuit, a digital / analog conversion circuit, and a phase comparison circuit. The term "digital circuit" is a general term for circuits that use digital-valued signals as data, and includes arithmetic circuits and memories composed of various logic circuits. [0003] In general, a digital circuit processes digital signals so that it is highly resistant to noise and can operate with a weak signal, so it has high speed and low power consumption. On the other hand, an analog circuit processes an ana...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L25/065
CPCH01L2924/14H01L25/18H01L2224/48145H01L24/48H01L2224/48091H01L25/0657H01L2225/06506H01L23/16H01L2225/06527H01L2224/451H01L2924/00014H01L24/45H01L2224/05554H01L2224/73265H01L2924/10162H01L24/49H01L2224/49175H01L2924/00H01L2224/45099H01L2224/05599H01L2924/00012
Inventor 竹泽良典长谷川和弘浅野隆浩中田崇司
Owner SANYO ELECTRIC CO LTD