Heat sinking test method

A test method and new technology, applied in the testing of machine/structural components, measuring devices, measuring heat, etc., can solve the problems of insufficient test focus, low test efficiency, large data recording errors, etc., and achieve perfect test hardware equipment , Improve test efficiency and meet the effect of quantity requirements

Inactive Publication Date: 2007-10-31
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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Problems solved by technology

[0005] 1. The focus of the test is not comprehensive enough
Previously, the focus was mainly on the measurement of the CPU temperature, but the attention paid to other key components such as hard disks and memory was obviously insufficient. Measurements were not performed or only individual points were measured randomly. The test lacked purpose and planning, and the results obtained The data does not reflect the overall cooling performance of the system
[0006] 2. Large errors in data recording
In the past, to read da

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Embodiment Construction

[0026] The present invention will be further explained below in conjunction with accompanying drawing and specific embodiment, realizes the best embodiment of a kind of novel heat dissipation test method of the present invention as follows:

[0027] The temperature tester Agilent 34970A used not only has the function of detecting temperature, but also has the function of real-time communication, which can send the data to the communication PC in real time, and the curve can be used on the terminal to reflect the temperature change in real time, and the data can be saved at the same time for the follow-up Analysis (as shown in Figure 1).

[0028] The temperature tester Agilent 34970A supports the RS-232 protocol. Use a nine-pin data cable to connect the Agilent 34970A to the terminal monitor, and run the control terminal software Agilent BenchLink DataLogger to realize the control of the temperature tester. The main operations that can be realized in Agilent BenchLink Data Logg...

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Abstract

This invention relates to one temperature test field and provides one new dissipation test method, which comprises the following technique keys: it makes the system not only for CPU temperature in testing and integrating the hardware, memory and south and north bridges into test range to totally test system effect; it not only tests part and improves multiple test points hardware to improve test efficiency without human tracing to satisfy the system test point data needs to take place of opaque glue to make the test data more accurate.

Description

technical field [0001] The invention relates to the field of temperature testing, and specifically provides a novel heat dissipation testing method. Background technique [0002] Today, with the continuous improvement of computer system power, its cooling performance has increasingly become the bottleneck of system design. If this part is poorly designed, it is very easy to cause system crashes, restarts, etc., which may cause the loss of user data, or cause major economic losses. At the same time, it will also reduce users' awareness of products and brands. [0003] A good heat dissipation system design process must include a large number of tests to grasp the heat distribution of the system, test the design effect in the early stage, and determine the direction of subsequent improvement. The test methods used in this process, the quality and experience of the testers, It directly affects the reliability and scientificity of the test data. Therefore, it is very necessary t...

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Application Information

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IPC IPC(8): G01M19/00G01K7/02G06F11/22G01M99/00
Inventor 滕学军吴明生葛峰姚萃南
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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