A chip packaging structure disclosed by the present invention comprises a cover plate, a cover plate, a chip body, a substrate, a supporting plate and a base, the middle part of the substrate is provided with an inner concave cavity, the chip body is fixed in the inner concave cavity, the cover plate is pressed on the top surface of the substrate, the supporting plate is connected to the bottom surface of the substrate, the supporting plate is installed in the base, and the cover plate is attached to the upper surface of the cover plate and matched with the base in a clamped mode. According to the invention, the substrate with the concave cavity structure is adopted to fix and paste the chip body, so that limiting installation is facilitated in the packaging process, and the cover plate, the substrate and the supporting plate are sequentially nested and inserted from top to bottom to form a stable interlayer whole, so that the chip body is effectively prevented from loosening and shifting; after the interlayer is integrally fixed in the cover plate and the base, compact and firm packaging is carried out, a simple and light integral structure is formed, and the protection stability and the sealing reliability of the integral structure of the device can be improved.