The utility model discloses a water bath contact vertical continuous
electroplating device, which comprises an
electroplating bath and a fixing frame arranged above the
electroplating bath, a plurality of groups of
anode assemblies which are transversely and sequentially arranged are arranged in the electroplating bath, and each
anode assembly comprises a first electroplating
anode and a second electroplating anode which are oppositely arranged; a first rectifying
machine and a second rectifying
machine are arranged on the fixing frame, a
cathode hanging tool capable of translating transversely is arranged in the electroplating bath, a PCB to be electroplated is hung on the
cathode hanging tool, a
cathode conductive
copper brush is arranged on the cathode hanging tool, a cathode conductive
copper rail is arranged below the cathode conductive
copper brush, and the cathode conductive copper rail is arranged below the cathode conductive copper
brush. The cathode conductive copper rail is connected to the cathode of the first
rectifier and the cathode of the second
rectifier through cables, the cathode conductive copper brush makes contact with the cathode conductive copper rail, and the cathode conductive copper brush and the cathode conductive copper rail are both soaked in a preset water bath solution. According to the utility model, the safety and reliability of the PCB electroplating process can be improved.