LED display screen and encapsulation method thereof

A technology of light emitting diode and packaging method, applied in the field of display screen, can solve the problems of uneven surface of the display screen, small viewing angle of the display screen, poor flatness of the display screen, etc., and achieves improved flatness, good consistency, and streamlined production. effect of the process

Active Publication Date: 2009-01-21
CHINA RAILWAYS CORPORATION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned hardware mode mainly has the following disadvantages: since the existing light-emitting diode display screen is assembled from a plurality of digital dot matrix modules, it takes a lot of energy and time to debug the consistency of brightness and color of each dot matrix module; In the process of assembling multiple dot matrix modules on the circuit b...

Method used

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  • LED display screen and encapsulation method thereof
  • LED display screen and encapsulation method thereof
  • LED display screen and encapsulation method thereof

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Embodiment Construction

[0025] The core of the present invention is to provide a light emitting diode display screen, which has better consistency of brightness, color, etc., and the flatness of the screen is higher. Another core of the present invention is to provide a packaging method for a light emitting diode display screen.

[0026] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0027] Please refer to figure 1 , figure 1 It is a flowchart of a specific implementation manner of the packaging method of the light-emitting diode display screen provided by the present invention.

[0028] In a specific embodiment, the packaging method of the light-emitting diode display screen provided by the present invention may specifically include the following steps:

[0029] Step S1: Provide a printed circuit board.

[0030] Accordin...

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Abstract

The invention discloses a light emitting diode display screen, wherein a light emitting diode naked chipset is stuck on the front surface of a printing circuit board, and the outer side of the light emitting diode naked chipset is equipped with an integrated encapsulated sticking membrane. The invention further discloses an encapsulated method of the light emitting diode display screen. Because the light emitting diode display screen uses a special device to do a patch treatment of the light emitting diode naked chipset, simultaneously, the encapsulated sticking membrane is an integrated body, the leveling of the light emitting diode display screen which is obtained by the method is observably improved, a wave phenomenon can be avoided to produce when words or images are displayed, and the color of the display screen also can have a higher consistency.

Description

Technical field [0001] The invention relates to a display screen, in particular to a display screen using a semiconductor light emitting diode (LED) as a luminous body. The invention also relates to a packaging method of the above-mentioned display screen. Background technique [0002] The light-emitting diode display is a new type of information display medium that has developed rapidly around the world in the late 1980s. In less than two decades, light-emitting diodes have rapidly grown into mainstream products in the flat panel display field and have been widely used. [0003] The application range of LED displays involves many social and economic fields, such as financial information display of stock exchanges and banks; airport flight dynamic information display; passenger guidance information display such as ports, stations, and passenger trains; road traffic information display; sports venues , Command center, shopping mall and other large places information display. There...

Claims

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Application Information

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IPC IPC(8): G09F9/33
Inventor 张凌云徐军陈天喜刘东亮
Owner CHINA RAILWAYS CORPORATION
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