Gibbosity type kettle mouth with external-open tin-overflowing mouth

A pot mouth and overflow tin technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of low work efficiency, easy formation of virtual welding of contacts, and is not suitable for large-scale batch processing, so as to ensure adequacy and firmness. Effect

A pot mouth and overflow tin technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of low work efficiency, easy formation of virtual welding of contacts, and is not suitable for large-scale batch processing, so as to ensure adequacy and firmness. Effect

CN101415298AInactive Publication Date: 2009-04-22SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Gibbosity type kettle mouth with external-open tin-overflowing mouth
  • Gibbosity type kettle mouth with external-open tin-overflowing mouth

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] Such as figure 1 The shown one has a convex-shaped spout with an overflowing tin spout, which has a rectangular main spout 1, and a branch spout 2 is arranged on one of the long sides of the main spout 1, and short spouts are arranged on both sides of the main spout 1. Side spouts 3 are respectively arranged on the sides, and a half enclosing area is formed by the main spout 1, branch spouts 2 and side spouts 3, and a tin overflow spout 4 is arranged on the interconnected tin outlet walls facing each other. The tin overflow opening 4 is a rectangular opening with a depth of 2-8 mm.

[0013] Such as figure 2 As shown, the spout of the present invention is applied to the electronic components 3 to be welded on the PCBA board 5 and is mainly distributed outside the spout, and there are other electronic components 3 in the semi-enclosed area.

[0014] When in use, place the PCBA board 5 at a predetermined position above the spout, and keep a certain distance between the ...

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Abstract

The invention relates to a solder pot component applicable for PCBA (Printed Circuit Board Assembly) tin solder, in particular to a solder pot spout. The solder pot spout comprises a rectangular main spout. An auxiliary spout is arranged on the long edge of the main spout; the short edges on the two sides of the main spout are respectively provided with a side spout. A half-encircled area is enclosed by the main spout, the auxiliary spout and the side spouts. Tin leaking mouths are arranged on the walls of the interconnected face-to-face tin discharging mouth. The solder pot spout has simple structure so that the solder pot spout can effectively improve welding efficiency. Therefore, the solder pot spout applies to mass automatic production. Furthermore, the solder pot spout can effectively avoid oxide layer on the surface of the tin liquor from remaining on the surface of the PCBA, thereby ensuring the quality of the welded connection point.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to a tin furnace spout. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, and at the same time, it is guara...

Claims

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Application Information

Patent Timeline
22 Apr 2009
Publication
CN101415298A
IPC
H05K3/34
Inventors
庄春明