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Grounding structure of electronic device

A technology for grounding structures, electronic devices, applied in the direction of circuit layout on support structures, power distribution for digital processing, etc.

Inactive Publication Date: 2012-05-23
张凤莉
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a grounding structure of an electronic device, the circuit board of which is less prone to poor contact when grounded through the housing

Method used

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  • Grounding structure of electronic device
  • Grounding structure of electronic device
  • Grounding structure of electronic device

Examples

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Embodiment Construction

[0017] figure 1 Is a schematic diagram of a ground structure of an electronic device according to an embodiment of the present invention, and figure 2 for figure 1 Front view of the circuit board in. In the following embodiments, the transfer circuit board used for connecting between the hard disk drive and the main board in the server is grounded through the bottom plate of the server housing as an example. Wherein, the transfer circuit board is electrically connected to the main board disposed in the server through a soft flat cable, for example.

[0018] In addition, in order to describe the features of the present invention more clearly, the drawings in the following embodiments omit components that are less relevant to the present invention, such as the motherboard and hard disk drive in the server. Moreover, the housing part only schematically shows the bottom plate, the frame, the positioning part and the limiting part, and other components are omitted. Wherein, the tra...

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PUM

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Abstract

The invention discloses an earthing structure for an electronic device, which comprises a shell body, a circuit board and an elastic cushion; wherein, the shell body is provided with a base plate and a frame vertically connected to the baseplate, and the frame is horizontally and protrudingly provided with at least one location portion; the circuit board is provided with an earthing circuit layer and a conductive layer; the earthing circuit layer is allocated on the circuit plate; the conductive layer is allocated at one side of the circuit plate and is electrically connected with the earthing circuit layer. The elastic cushion is arranged on the base plate; when the circuit board is vertically arranged on the base plate, the conductive layer is contacted with the elastic cushion and is electrically connected with the base plate through the elastic cushion, so as to lead the earthing circuit layer to be earthed through the baseplate.

Description

Technical field [0001] The present invention relates to an electronic device, and particularly relates to a grounding structure of an electronic device. Background technique [0002] In the current server architecture, the case of the server usually has a back frame vertically arranged on the base plate. In addition, a transfer circuit board (transferring circuit board) used to connect between a hard disc device (HDD) and a motherboard (MB) is usually fastened to the back frame by screws. [0003] Under the above-mentioned structure, the transit circuit board usually has a through hole for passing through the screw, and a grounding point is usually arranged around the through hole. When the transfer circuit board is screwed to the screw hole of the back frame, the ground point of the transfer circuit board can be connected to the back frame through the screw, so that the transfer circuit board can pass through the back frame Ground. [0004] However, because the screw locking desi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/02G06F1/18
Inventor 陈伟仕
Owner 张凤莉
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