Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A mobile phone card and its implementation method

A realization method and mobile phone card technology, applied to computer components, record carriers used by machines, instruments, etc., can solve the problems of complex production process, high production cost, poor reliability, etc., achieve good application prospects, low overall cost, Versatile effect

Inactive Publication Date: 2012-02-22
SHANGHAI CHANGFENG SMART CARD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the field of smart card packaging, especially the use of mobile phone cards is very large, but currently they are produced using traditional techniques. The main raw materials are carrier tape, silver glue, epoxy resin glue, hot melt glue, PVC card base, etc. These The cost of materials is also relatively high, and the production process is complicated, the production cost is high, and the products produced by traditional technology have the disadvantages of low yield and relatively poor reliability in use.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A mobile phone card and its implementation method
  • A mobile phone card and its implementation method
  • A mobile phone card and its implementation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention will be further explained in conjunction with specific drawings.

[0037] Such as Picture 9 As shown, a mobile phone card includes a chip 1, a carrier tape 2 for carrying the chip 1, and a circuit 3 arranged on the carrier tape 2. The carrier tape 2 is a metal made of copper or copper alloy materials. A carrier tape, on the back of the carrier tape 2 is attached a heat-sensitive film that prevents the molding compound from overflowing and flowing to the metal contacts 4 on the reverse side during the packaging process and affecting product quality. The carrier tape 2 has a thickness of 0.06mm to 0.15mm; the finished product has a thickness of 0.065mm to 0.155mm. The appearance of the carrier tape 2 is formed by chemical etching or precision stamping.

[0038] The mobile phone card has a nominal length of 25.0±0.1mm, a width of 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A new mobile phone card is provided, which includes a chip, a tape carrier carrying the chip, and circuitry set on the tape carrier. The tape carrier is metallic. A thermal inductive film is stuck on the back side of the tape carrier. The thermal inductive film is used to prevent the molding compound overflows to inverse metallic contacts in the package process. Overflowing can influence the quality of product. The new card can be used in all kinds of mobile phones or wireless communication products widely; solves packaging process used in new mobile phone card effectively, promotes the development of global mobile phone application technology greatly. It also has strong universality, low cost, and high reliability. The new card that has better application future can meet requirements in many kinds of application field, such as SIM cards of china mobile communications, SIM and UIM cards of china united telecommunications, and other mobile communication products, such as wireless network cards, wireless base station, and public telephones.

Description

Technical field [0001] The invention relates to the field of microelectronic semiconductor packaging technology, integrated circuit packaging technology and mobile phone SIM card chip packaging, in particular to a mobile phone card and an implementation method thereof. Background technique [0002] With the continuous advancement of integrated circuit packaging technology, the integration of integrated circuits is increasing day by day, and the functions are becoming more and more abundant. For new application requirements, integrated circuit packaging companies are required to design new packaging forms to meet new needs. In the field of smart card packaging, especially mobile phone cards, the usage is very large, but they are currently produced using traditional technology. The main raw materials are carrier tape, silver glue, epoxy resin, hot melt glue, PVC card base, etc. The cost of materials is also relatively high, and the production process is complex, the production cost...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077H01L23/498H01L21/50H01L21/60
CPCG06K19/07745G06K19/07724H01L2224/48091H01L2224/48247H01L2224/45144
Inventor 杨辉峰洪斌
Owner SHANGHAI CHANGFENG SMART CARD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com