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Big foot lift pin

A pin and locking pin technology, used in electrical components, circuits, semiconductor/solid-state device manufacturing, etc., can solve problems such as corrosion of metal spring washers, wafer handover errors, and increased lift pin damage rate.

Inactive Publication Date: 2011-05-25
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The difficulty with existing floating lift pin designs is that placing wafers in narrow heater cassettes can lead to wafer handover errors
The design of fixing the floating lift pin can solve the problem of placing the wafer in the narrow heater box, but this too forced design increases the damage rate of the lift pin as a result, including the metal spring Gasket rust

Method used

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  • Big foot lift pin
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Examples

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Embodiment Construction

[0024] Embodiments described herein generally provide an apparatus for processing semiconductor substrates. The specific embodiments described herein can be exemplarily applied to a processing system, such as a chemical vapor deposition processing system (Chemical vapor deposition, CVD, which is commercially available from Applied Materials, Inc., Santa Clara, California, USA. However, it should be understood that Yes, specific embodiments described herein can be incorporated into other chamber configurations, such as physical vapor deposition chambers, etch chambers, ion implantation chambers, and other semiconductor processing chambers.

[0025] figure 1 A cross-sectional view of processing system 100 is depicted. In general, the system 100 includes a chamber 102 coupled to a gas source 104 . The cavity 102 is generally a unitary processing structure, which may be made of a rigid block of material such as aluminum. The chamber 102 has a showerhead 106 and a substrate supp...

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PUM

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Abstract

Embodiments described herein generally provide a lift pin assembly having increased wafer placement accuracy, repeatability, reliability, and corrosion resistance. In one embodiment, a lift pin assembly for positioning a substrate relative to a substrate support is provided. The lift pin assembly comprises a lift pin comprising a pin shaft, a pin head coupled with a first end of the pin shaft for supporting the substrate, and a shoulder coupled with a second end of the pin shaft. The lift pin assembly further comprises a cylindrical body slidably coupled with the pin shaft and a locking pin for preventing the cylindrical body from sliding along the shaft, wherein the shoulder has a through-hole dimensioned to accommodate the locking pin.

Description

technical field [0001] Embodiments described herein generally relate to a lift pin and a lift pin assembly for separating a substrate from a substrate support. Background technique [0002] Integrated circuits have evolved into complex assemblies with millions of transistors, capacitors, and resistors on a single chip. Advances in chip design have produced faster circuits and greater circuit density. As the demand for integrated circuits continues to increase, chip manufacturers need semiconductor processing equipment that can increase wafer throughput and product yield, and that the processing equipment is more robust. To this end, processing equipment is being developed to minimize errors during wafer handover, reduce particulate contamination, and increase the lifetime of equipment components. [0003] The lift pins are generally disposed in guide holes of the substrate support. The upper end of the lift pin is generally in an expanded shape to prevent the lift pin fro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/687H01L21/205
CPCH01L21/68742H01L21/205H01L21/683H01L21/687
Inventor 戴尔·R·杜·博伊斯马克·A·福多尔卡希克·贾纳基拉曼胡安·卡洛斯·罗奇-阿尔维斯
Owner APPLIED MATERIALS INC