Semiconductor water dispenser
A semiconductor and water dispenser technology, applied in the field of semiconductor water dispensers, can solve the problems of increased cost, increased water dispenser cost, complex structure, etc., and achieves the effects of accelerating energy transfer speed, water temperature quickly tending to uniformity, and overall simple structure.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2015-07-08
Smart Images
Figure 1 Figure 2
Abstract
Description
Technical field
[0001] The invention relates to a water dispenser, in particular to a semiconductor water dispenser using semiconductor refrigeration. Background technique
[0002] Drinking fountains emerged in the 1990s. They use pure water or filtered tap water as the water source, which is clean and hygienic and easy to use. At present, the hot and cold water fountains are the most common on the market. The heating methods of the existing water dispensers are basically the same, but there are many cooling methods, such as the use of semiconductor refrigeration or refrigerant refrigeration. Water dispensers that use semiconductor refrigeration chips consume relatively little power, and do not use refrigerants and other substances that can cause environmental pollution, which is energy-saving and environmentally friendly. However, the cold water tanks of traditional semiconductor refrigeration water dispensers are fixed. The water in the cold water tank is exchanged for energy ...
Examples
Embodiment
[0026] Such as figure 1 , figure 2 As shown, the semiconductor water dispenser of the present invention includes a housing 100 in which a refrigeration device 200, a heating device 300, and a room temperature device 400 are respectively arranged, and a water tank 110 connected to a bucket 500 is provided at the upper end of the housing 100. The water tank 110 is respectively connected with the refrigeration device 200, the heating device 300 and the room temperature device 400. The bottom of the refrigeration device 200 and the bottom inside the casing 100 are supported and connected by a spring 600. The casing 100 is provided with a cold water outlet 210 and a heat The water outlet 310, the cold water outlet 210 and the hot water outlet 310 are respectively connected to the refrigeration device 200 and the heating device 300 through pipelines, and the refrigeration fins 220 of the refrigeration device 200 are semiconductor refrigeration fins.
[0027] The refrigeration device 2...