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Information processing equipment

A technology for information processing equipment and housings, applied in the direction of digital processing power distribution, etc., can solve the problems of increased manufacturing costs, reduced notebook thickness, poor user experience, etc., to reduce manufacturing and maintenance costs, improve user experience, and enrich The effect of scalability

Active Publication Date: 2011-11-23
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0005] For example, due to the thin thickness of the notebook, the heat dissipation is not good, which leads to the overheating of some places on some notebook casings (for example, around the keyboard), so the user experience is very bad
[0006] In addition, because many notebook products reduce their thickness at the expense of keyboard travel or screen opening and closing angles, the human-computer interaction between users and notebooks feels poor
At the same time, due to the thin and light design of the notebook, the structural complexity of the various components inside the notebook increases, which leads to an increase in its manufacturing cost and increases the difficulty of maintenance.
[0007] In addition, in order to save space, the battery size of thin and light notebooks is usually smaller, which leads to smaller battery capacity and reduces battery life
In addition, due to the large size of most thin and light notebooks in order to reduce the thickness of the notebook, it is not easy to carry

Method used

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Embodiment Construction

[0029] Exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. Here, it should be noted that, in the drawings, the same reference numerals are assigned to components having substantially the same structure and function, and redundant descriptions on components that are substantially the same are omitted in order to make the description more concise.

[0030] figure 1 is a schematic diagram illustrating the layout of an information processing device according to an exemplary embodiment of the present invention.

[0031] Such as figure 1 As shown, an information processing device 100 such as a notebook includes a first housing 101 , a second housing 102 , a third housing 103 , a first connection part 104 and a second connection part 105 . For example, the first housing 101 can accommodate computing components, the second housing 102 can accommodate display components, and the third housing 103 can ...

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PUM

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Abstract

The invention discloses information processing equipment, which comprises a first shell accommodating an operational unit, a second shell accommodating a display unit, a third shell accommodating an input unit and a power supply unit, a first connecting unit connected with the first shell and the third shell respectively, and a second connecting unit connected with the second shell and the third shell respectively.

Description

technical field [0001] The present invention relates to an information processing device. More specifically, the present invention relates to a layout design of an information processing device. Background technique [0002] With the increasing popularity of electronic equipment such as notebooks, the fashion requirements for notebook products are becoming higher and higher. In recent years, a trend in the development of notebooks is to make notebooks thinner and lighter. Various manufacturers continue to introduce thin and light notebook products. But these notebook products usually follow the traditional way of layout design. [0003] For example Apple ( )’s notebook computer adopts the appearance modification method, which makes the notebook feel very thin from a visual point of view, but its actual thickness is 4mm to 19.4mm, resulting in a relatively high average thickness. [0004] Although various designs for making notebooks thinner and lighter have been propos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18
Inventor 杨志锋代皇刘化冰杨大业
Owner LENOVO (BEIJING) LTD
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