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Water-cooled totally-closed computer case

A computer, fully enclosed technology, applied in computing, instruments, electrical and digital data processing, etc., can solve problems such as unobjective cost, and achieve the effect of improving the repair rate and reducing noise.

Inactive Publication Date: 2011-11-23
邹新辉
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some people proposed to use a refrigeration device to dissipate heat. Nowadays, what can be done with a fan heat sink is a bit of a fuss to use a refrigeration device, especially in terms of cost. In fact, there is no use in the market.

Method used

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  • Water-cooled totally-closed computer case
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  • Water-cooled totally-closed computer case

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Experimental program
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Effect test

Embodiment Construction

[0024] Depend on Figures 1 to 12 As can be seen, the present invention comprises casing and computer components such as CPU, south bridge, graphics card, optical drive, hard disk, power supply that are arranged in the casing, and its characteristics are:

[0025] The chassis 1 and the components in the chassis are provided with a circulating water cooling device. The circulating water cooling device includes a heat sink device 2 arranged outside the chassis 1, a heat dissipation package arranged on each component in the closed chassis 1, and various connecting pipes, wherein:

[0026] The heat dissipation package is composed of an aluminum core 21 for heat absorption and heat transfer, and a plastic shell 22 that is leak-proof and heat-proof. The plastic shell 22 is equipped with a water inlet 19 and a water outlet 20, and the water inlet and outlet are connected to the water flow channel in the plastic shell. Through; the heat dissipation package on each component is connect...

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Abstract

The invention relates to a water-cooled totally-closed computer case. A circulating water cooling device is arranged on the computer case and elements in the computer case and comprises a cooling fin device, cooling packages and connecting pipelines, wherein the cooling fin device is arranged outside the computer case, the cooling packages on the elements are respectively arranged on all the elements in the closed computer case and connected together through the connecting pipelines so that water runners of all the elements are communicated, the cooling fin device comprises a shell, water circulating pipes in the shell and cooling fins arranged on the water circulating pipes, the water circulating pipes are connected in series through the connecting pipelines, the shell is also provided with a water inlet and a water outlet which are communicated with the water circulating pipes, the water inlet and the water outlet are respectively connected with a start end and a terminal end of the water runner formed by the connected cooling packages of all the elements, and the pipelines which are communicated form water circulation through a water pump. According to the closed computer case, internal elements in a computer can run in a dust-free space with stable humidity and temperature, and noise is reduced.

Description

technical field [0001] The invention relates to a computer case, in particular to a water-cooled fully enclosed computer case. Background technique [0002] The existing computer case uses the principle of metal conduction heat absorption and air convection heat dissipation. Its disadvantages are mainly manifested in: a. Dust entanglement; b. The ideal operating temperature of the CPU cannot be realized; c. The humidity required for computer operation cannot be controlled; d. Loud noise. Especially dust and humidity greatly reduce the stability, operating life and repair rate of the computer. [0003] Briefly speaking, computer cases ranging from 386, 486, ... to the current Pentium, Core i7, Athlon, and Phenom II are all labels of rapid development in the past 30 years. In terms of performance, it can be said to be earth-shaking, but from the perspective of the computer's cooling device and chassis, it is from a simple heat sink to a heat sink + fan. To be precise, it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
Inventor 邹新辉
Owner 邹新辉
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