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Pressure Sensor

A pressure sensor, press-fit technology, applied in the direction of measuring fluid pressure, instruments, measuring fluid pressure through electromagnetic components, etc., can solve the problem of not eliminating the cost of disposing the spring and so on

Active Publication Date: 2015-09-09
SENSATA TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, the cost of disposing of the springs is not eliminated, but merely moved into the supply chain, so no cost benefit accrues

Method used

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Examples

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Embodiment Construction

[0030] Embodiments of the invention disclosed herein provide novel pressure sensors for use in measuring pressure. Embodiments disclosed herein include newly designed glue flow barriers that isolate certain printed circuit board (PCB) features and components from protective glue applied to other areas of the PCB. Additionally, embodiments include a newly designed contact spring adapted to facilitate pressure sensor fabrication while minimizing the effects of tolerance buildup. Specifically, in one embodiment, the support ring includes planar mounting tabs that provide stable support for a single electronics board and provide support for resilient contact members, such as double-ended symmetrical springs, which Double-ended symmetrical springs have a conical shape at both ends.

[0031] figure 1 A pressure sensor 100 constructed in accordance with an exemplary embodiment is shown. The pressure sensor 100 includes a contact housing subassembly 108 that includes an upper sprin...

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Abstract

A pressure sensor (100) includes a sense element port (114), a support ring (110) and a plurality of interference fit slits (132) to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board (122) inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.

Description

technical field [0001] The present invention relates generally to pressure sensors, and more particularly to sensors that use strain gauge technology to sense changes in pressure to generate electrical signals related to such changes and employ electronics to process and amplify the signals. Background technique [0002] Although the use of strain gauge technology to convert changes in fluid pressure into relevant electrical signals is known, there is a need to provide sensors that are easier to manufacture and that have improved reliability and optimal anticipation life. There is also a need to minimize the production cost of sensors, thereby making their use in a given application more economically feasible, and thus increasing manufacturing volumes, resulting in savings in mass manufacturing technology. [0003] In issued U.S. Patent 6,763,724, issued to the assignee of the present invention, there is disclosed and claimed a pressure transducer using strain gauge technol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L9/00G01L19/14H05K1/02
CPCG01L19/14
Inventor A·F·威尔纳G·福奥内P·安巴迪L·斯内德克B·维尔基G·普罗姆L·特玛索
Owner SENSATA TECHNOLOGIES INC