Double sealing face fin plate-type heat exchanger

A plate heat exchanger, double-sealed technology, applied in heat exchanger types, indirect heat exchangers, heat exchange equipment, etc., can solve problems such as failure, loss, environmental and safety accidents, and achieve short flow distance and reliable products Enhanced performance and improved reliability

Inactive Publication Date: 2012-02-01
高邮市荣清机械电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to reasons such as design and manufacturing, there will still be failures, which will lead to environmental and safety accidents and cause huge losses

Method used

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  • Double sealing face fin plate-type heat exchanger
  • Double sealing face fin plate-type heat exchanger
  • Double sealing face fin plate-type heat exchanger

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The present invention will be further explained below in conjunction with the drawings and specific embodiments:

[0012] Such as figure 2 Shown: a double-sealed surface fin plate heat exchanger, including a double-sealed plate chip 5, a double-sealed solder plate 6, a lower solder plate 3, a fin 4 and an upper solder plate 2, above the double-sealed plate chip 5 There is an upper soldering piece 2, a lower soldering piece 3 is arranged under the double-sealed plate chip 5, a fin 4 is arranged between the upper soldering piece 2 and the lower soldering piece 3, and the double-sealing plate chip 5 is also provided Double sealing welding piece 6. The double-sealed plate chip 5 adopts two chamfers on the peripheral surface. The double sealing welding sheet 6 adopts a three-dimensional molding surface.

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PUM

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Abstract

The invention discloses a double sealing face fin plate-type heat exchanger which comprises a double seal plate-type chip, a double seal soldering flake, a lower soldering flake, fins and an upper soldering flake. The upper soldering flake is arranged on the upper surface of the double seal soldering flake. The lower soldering flake is arranged on the lower surface of the double seal soldering flake. The fins are arranged between the upper soldering flake and the lower soldering flake. The double seal soldering flake is arranged on the double seal plate-type chip. In the invention, after chips are laminated, two sealing faces are formed around; and due to the addition of the double seal soldering flake, after soldering, two soldering sealing faces are formed around, so that even though the inner sealing face is failed, the second layer of sealing face on the outside can still take a sealing effect, and thus, the reliability of a product is greatly promoted.

Description

Technical field [0001] The invention relates to the field of mechanical manufacturing, and in particular to the field of heat exchanger manufacturing. Background technique [0002] At present, the fin-plate heat exchanger has a high heat transfer coefficient due to the strong turbulence generated by the two heat exchange media under the action of the heat dissipation fins. At the same time, because each flow channel uses fins, The connection is brazed, so it can bear higher pressure. However, in some special use media, such as corrosive media, or flammable media with high safety requirements, the original single-layer superimposed seal, such as attached Figure one As shown, it is composed of a plate chip 1, an upper soldering sheet 2, a lower soldering sheet 3 and a fin 4, which are stacked in sequence, and the surrounding welding sealing surface is only a single layer. Due to design and manufacturing reasons, failures will still occur, which will lead to environmental and safet...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D9/00F28F3/10
Inventor 吴一鹏
Owner 高邮市荣清机械电子有限公司
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