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Substrate processing system, substrate holder, substrate holder pair, substrate joining apparatus and device manufacturing method

A substrate processing system and substrate support technology, which is applied in semiconductor/solid-state device manufacturing, electrical solid-state devices, semiconductor devices, etc., can solve problems such as poor circuit operation, insufficient heating and pressing, and insufficient bonding strength.

Active Publication Date: 2012-07-11
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the case of stacking two semiconductor substrates, if dust is caught between the semiconductor circuit regions facing each other, even a small amount will cause circuit failure
In addition, insufficient local heating and pressure may lead to insufficient joint strength

Method used

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  • Substrate processing system, substrate holder, substrate holder pair, substrate joining apparatus and device manufacturing method
  • Substrate processing system, substrate holder, substrate holder pair, substrate joining apparatus and device manufacturing method
  • Substrate processing system, substrate holder, substrate holder pair, substrate joining apparatus and device manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0082] figure 1 It is an explanatory diagram schematically showing the substrate bonding apparatus 1010 according to the first embodiment. The substrate bonding apparatus 1010 includes an alignment device 1011 for aligning the relative positions of a first substrate 1016 as a semiconductor wafer and a second substrate 1017 as a semiconductor wafer stacked thereon. In addition, a bonding device 1012 for bonding the first substrate 1016 and the second substrate 1017 aligned by the alignment device 1011 to each other is provided.

[0083] The first substrate 1016 is held by the first substrate holder 1014 , and the second substrate 1017 is held by the second substrate holder 1015 . In the alignment device 1011 , when the first substrate 1016 and the second substrate 1017 are aligned, the first substrate holder 1014 and the second substrate holder 1015 sandwich and integrate them to form a substrate holder pair 1018 . A specific configuration of the substrate holder pair 1018 wi...

no. 2 Embodiment approach

[0137] Figure 18 It is an explanatory diagram schematically showing the substrate bonding apparatus 2010 according to the second embodiment. The substrate bonding apparatus 2010 includes an alignment device 2011 for aligning the relative positions of a first substrate 2016 as a semiconductor wafer and a second substrate 2017 as a semiconductor wafer stacked thereon. In addition, a bonding device 2012 for bonding the first substrate 2016 and the second substrate 2017 aligned by the alignment device 2011 to each other is provided.

[0138] The first substrate 2016 is held by the first substrate holder 2014 , and the second substrate 2017 is held by the second substrate holder 2015 . In the alignment device 2011, when the first substrate 2016 and the second substrate 2017 are aligned, the first substrate holder 2014 and the second substrate holder 2015 clamp them and integrate them to form a substrate holder pair 2018. The specific configuration of the substrate holder pair 20...

no. 3 Embodiment approach

[0205] Figure 39 It is an explanatory diagram schematically showing the substrate bonding apparatus 3010 according to this embodiment. The substrate bonding apparatus 3010 includes an alignment device 3011 for aligning the relative positions of a first substrate 3016 as a semiconductor wafer and a second substrate 3017 as a semiconductor wafer stacked thereon. In addition, a bonding device 3012 for bonding the first substrate 3016 and the second substrate 3017 aligned by the alignment device 3011 to each other is provided. The bonding device 3012 applies pressure, or applies pressure and heat to the first substrate 3016 and the second substrate 3017 to achieve permanent bonding.

[0206] The first substrate 3016 is held by the first substrate holder 3014 , and the second substrate 3017 is held by the second substrate holder 3015 . In the alignment device 3011, when the first substrate 3016 and the second substrate 3017 are aligned, the first substrate holder 3014 and the se...

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PUM

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Abstract

Disclosed is a substrate processing system capable of suppressing inflow of dust into the region where semiconductor substrates are placed, when semiconductor substrates are stacked using a pair of substrate holders. The substrate processing system comprises: a substrate holder system in which a first substrate holder that holds a first substrate and a second substrate holder that holds a second substrate are placed facing each other in order to clamp the first substrate and the second substrate therebetween; and a dust inflow prevention section including a processing device that holds the substrate holder system and that prevents inflow of dust into the region where the first substrate and the second substrate are clamped, in the substrate holder system and / or the processing device. The substrate holder system may be provided with a dust inflow prevention mechanism that prevents inflow of dust into the region where the substrates are held, in either of the substrate holders.

Description

technical field [0001] The invention relates to a substrate processing system, a substrate support, a substrate support pair, a substrate bonding device and a device manufacturing method. Background technique [0002] There is a stacked semiconductor device manufactured by stacking semiconductor substrates on which elements, circuits, and the like are formed. In the case of stacking semiconductor substrates, a pair of semiconductor substrates held by a substrate holder are precisely positioned and stacked with the accuracy of the line width of a semiconductor circuit, and then the entire substrates are heated and pressed for bonding. At this time, the pair of semiconductor substrates are positioned using a positioning device, and heated and pressed using a heating and pressing device to achieve permanent bonding. [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 11-261000 [0004] Patent Document 2: Japanese Patent Laid-Open No. 2005-251972 [0005] Pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/02
CPCH01L21/67092H01L21/683H01L24/10H01L24/26
Inventor 菅谷功长南纯一前田荣裕田中庆一保多智之
Owner NIKON CORP