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Light emitting diode package and manufacturing method thereof

A technology of light-emitting diodes and manufacturing methods, applied in the direction of electrical components, electrical solid-state devices, semiconductor devices, etc., capable of solving problems such as confinement and increased refractive index

Inactive Publication Date: 2012-09-26
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are technical limitations to such enhancements
Furthermore, although the use of air bubbles can increase the viewing angle of the LED package through diffusion, it limits the increase in the refractive index.

Method used

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  • Light emitting diode package and manufacturing method thereof
  • Light emitting diode package and manufacturing method thereof
  • Light emitting diode package and manufacturing method thereof

Examples

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Embodiment Construction

[0039] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. However, aspects of the present invention are not limited to the exemplary embodiments.

[0040] In the following description, when it is determined that a detailed description of well-known functions related to the present invention and the configuration of the present invention would obscure the gist of the present invention, they will be omitted. Terms used herein are for the purpose of describing specific embodiments only, and definitions may be changed according to intentions of users, operators, or customers. Therefore, the terms and words should not be defined according to the description in the specification.

[0041] figure 1 is a cross-sectional view showing the structure of a light emitting diode (LED) package according to an embodiment o...

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PUM

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Abstract

A light emitting diode (LED) package refracting or reflecting light emitted from an LED chip is disclosed. The LED package may include a substrate, an LED chip mounted on the substrate, a lens unit formed by injecting an encapsulant adapted to enclose and protect the LED chip, and at least one refraction member disposed in the lens unit. The at least one refraction member may refract or reflect the light emitted from the LED chip.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2011-0024859 filed with the Korean Intellectual Property Office on March 21, 2011, the disclosure of which is hereby incorporated by reference. technical field [0002] The present invention relates to a light emitting diode (LED) package that outwardly emits a wide light beam by providing a mold unit or a lens unit with a refraction member that refracts or reflects light emitted from an LED chip. Background technique [0003] A light-emitting diode (LED) chip refers to a light source that can be formed by changing compound semiconductor materials such as gallium arsenide (GaAs), aluminum gallium arsenide (AlGaAs), gallium nitride (GaN), indium gallium indium phosphide (InGaInP) A semiconductor device that realizes light of various colors. [0004] Recently, LED chips have been developed from a general low-brightness type to a high-brightness high-quality type. Accordingly, the LED chip is manufa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/58H01L33/62
CPCH01L33/54H01L2933/005H01L33/58H01L2224/48091H01L2924/181H01L2924/00012H01L2924/00014H01L33/52
Inventor 朴宪勇金智贤俞在成黄圣德宋永僖
Owner SAMSUNG ELECTRONICS CO LTD