Integrated flip type LED illuminating assembly

A technology of LED lighting and LED circuits, which is applied to the components of lighting devices, lighting devices, semiconductor devices, etc., can solve the problems of limited thermal conductivity, complex structure and process, and poor heat dissipation performance of thermal conductive adhesives, and achieve good light transmission Performance, material saving, process cost saving effect

Inactive Publication Date: 2013-02-13
田茂福
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The LED packaging structure and process of this LED light-emitting device are relatively complicated. Although thermal conductive adhesive is used, due to the limited thermal conductivity of the thermal conductive adhesive itself, and the number of heat dissipation layers is long and the path is long, it will also lead to high thermal resistance and poor heat dissipation performance. Wait

Method used

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  • Integrated flip type LED illuminating assembly
  • Integrated flip type LED illuminating assembly
  • Integrated flip type LED illuminating assembly

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Embodiment Construction

[0048] The present invention will be described in more detail below.

[0049] Glass is a transparent, airtight, and hard material. Glass is chemically inert in everyday environments and does not interact with living things. Glass is generally insoluble in acid (exception: hydrofluoric acid reacts with glass to form SiF4, which leads to corrosion of glass); but it is soluble in strong alkali, such as cesium hydroxide.

[0050] Glass in a narrow sense is defined as: an inorganic substance that does not crystallize during the cooling of the melt. According to this definition, amorphous substances produced by methods other than melting, such as vacuum evaporation, radiation exposure, gel heating, etc., cannot be called glass. There are also amorphous metals and amorphous polymer materials that are different from inorganic substances in composition and cannot be called glass. However, the broad definition of glass scientifically classifies glass according to the state and proper...

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PUM

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Abstract

The invention relates to an integrated flip type LED (Light Emitting Diode) illuminating assembly. The integrated flip type LED illuminating assembly comprises an LED circuit, a glass carrier for bearing the LED circuit as well as a flip type LED chip which is directly welded in a flip way and is packaged on the glass carrier, wherein the LED circuit and the flip type LED chip are integrated on the glass carrier. According to the integrated flip type LED illuminating assembly, the heat radiating performance and the light emitting performance of the LED lamp are greatly improved and a traditional LED circuit board structure is omitted, so that materials and the labor cost are greatly saved. The glass has favorable light transmitting performance, so that the glass can be used as an outer protecting structure of the LED lamp, fox example, the glass is directly used as a lamp tube of the LED lamp. Therefore, the materials, the price and the mounting cost are further saved.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to a novel integrated flip-chip LED lighting assembly. Background technique [0002] LED lighting fixtures in the prior art are generally formed by packaging LEDs on an independent traditional (flexible) circuit board and then connecting an external circuit. [0003] The flexible circuit boards in the prior art, whether single-sided, double-sided or multi-sided, generally use copper or copper alloy materials as circuit layer materials. For example, in a traditional double-sided flexible circuit board, the structure of the flexible circuit board is an insulating layer (for example, made of a typical PI material) in the middle, and a circuit layer made of copper foil is respectively provided on both sides of the insulating layer. , on the outside of the two layers of circuit layers (such as bonding, coating, coating or printing) protective cover film layer (typically CVL or related high t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V23/00F21V29/00H01L33/48H01L33/54H01L33/64F21Y101/02F21S4/24F21V29/85F21Y115/10
Inventor 田茂福
Owner 田茂福
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