Heat pump hot water apparatus

A hot water device and heat pump technology, applied in heating mode and central heating, can solve the problems of comfort damage of heating terminal, increase of installation area, etc., achieve stability and quietness, improve configuration balance, and realize miniaturization Effect

Inactive Publication Date: 2013-03-06
PANASONIC CORP
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AI Technical Summary

Problems solved by technology

[0008] In the heat pump water heater disclosed in Patent Document 1, the feed water heat exchangers are installed above and below the storage tank, and hot water for feed water is generated in the feed water heat exchangers using the hot water sent to the heating terminal. , the overall temperature of the hot water in the storage tank drops, as a result, the temperature of the hot water delivered to the heating terminal drops, so the comfort in the heating terminal is impaired
[0009] On the other hand, in Europe and other places, heat pump water heaters using geothermal heat are generally installed indoors, and the depth of the product is 600mm or less, so the installation is good. However, in Patent Document 2, the water heater body unit that accommodates the heat pump cycle, The tank unit that houses the water tank is installed independently of each other, which has the problem of increasing the installation area

Method used

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Embodiment Construction

[0059] For the heat pump water heating device of the first invention, the water storage tank is arranged on one side of the frame, the antifreeze circulation equipment and the heat pump circuit are arranged on the other side of the frame, and the water refrigerant heat exchanger is arranged on the ratio compression Machine height position. According to the present invention, by disposing the heavy and vibrating compressor on the base plate and disposing the water-refrigerant heat exchanger above it, it is possible to achieve stability and quietness when placing the heat pump water heater. In addition, the arrangement balance of the functional parts in the housing can be improved, and the housing can be miniaturized.

[0060] In the heat pump water heater of the second invention, especially in the first invention, the water refrigerant heat exchanger and the antifreeze refrigerant heat exchanger are arranged at a higher position than the compressor and the antifreeze circulatio...

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Abstract

The present invention provides a heat pump hot water apparatus, characterized in that the hot water tank (7) is disposed on one side of the casing (50), the antifreeze liquid circulating means (41) and the heat pump circuit are disposed on the other side of the casing (50), and the water / refrigerant heat exchanger (2) is disposed at a location higher than the compressor (1). According to this configuration, the heat pump circuit and the hot water tank circuit are accommodated in one casing (50), stability and noise-reduction effect can be realized when the heat pump hot water apparatus is installed, and the casing (50) can be made smaller in size by enhancing layout balance of functional parts in the casing (50).

Description

technical field [0001] The present invention relates to a heat pump type hot water (warm water) device for heating by using hot water generated by a heat pump circuit using geothermal heat. Background technique [0002] Conventionally, most of the market has been occupied by heating equipment using combustion fuel such as oil or gas as a heat source. However, in recent years, the heating market using heat pump technology has rapidly expanded. Heat pump technology is also used in existing air conditioners, and cooling and heating can be used at the same time. [0003] However, only conventional air conditioners have the problem of being difficult to warm the soles of the feet during heating. In order to solve this problem, a water heater using heat pump technology has been developed (Patent Document 1). [0004] In the hot water device described in Patent Document 1, high-temperature refrigerant and hot water are heat-exchanged, and the heated hot water after the heat exchan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24D3/18
CPCF24D11/0228F24D19/1039Y02B10/70Y02B10/40F24D11/0214F24D3/08F24D19/0095F24H9/148F24H4/04F24D2200/11F24D2200/12F24H9/02
Inventor 福永敏克青山繁男谏山安彦
Owner PANASONIC CORP
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