Melamine plate for drilling PCB (Printed Circuit Board), and preparation method thereof

A technology of melamine board and melamine resin, applied in chemical instruments and methods, paper/cardboard layered products, synthetic resin layered products, etc., can solve problems such as easy moisture absorption and warpage

Active Publication Date: 2013-04-03
HUNAN LIUXIN ELECTRONICS NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a melamine board for PCB drilling and a preparation method thereof. The emulsified wax is designed to solve the warpage problem caused by the existing melamine board for PCB drilling due to easy moisture absorption

Method used

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  • Melamine plate for drilling PCB (Printed Circuit Board), and preparation method thereof
  • Melamine plate for drilling PCB (Printed Circuit Board), and preparation method thereof
  • Melamine plate for drilling PCB (Printed Circuit Board), and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Taking urea-formaldehyde resin containing 0.3% curing agent as an example, add emulsifier (0.5% of the weight of urea-formaldehyde resin) and amino organic compound (0.08% of the weight of urea-formaldehyde resin) to analyze the different additives. The time required for the emulsified wax to demulsify in the urea-formaldehyde resin with the addition of curing agent. And take the urea-formaldehyde resin without adding any additives as a comparative example. Wherein, the emulsifier is emulsifier OP-10, and the amino compound is melamine. See Table 1 for specific results.

[0028] Table 1

[0029] Auxiliary do not add Emulsifier amino organic compound Emulsifiers and Amino Organic Compounds Time required for emulsified wax to demulsify / h 1.0 5.0 5.0 8.0

[0030] From the data analysis in Table 1, it can be seen that adding emulsifying wax or amino organic compound can prolong the demulsification time of emulsifying wax, among them, adding ...

Embodiment 2

[0032] Add a curing agent to the urea-formaldehyde resin to adjust the curing time of the urea-formaldehyde resin; add amino organic compounds, emulsifiers and emulsifying wax in sequence (the addition method adopts the addition method of adding while stirring) to make a gluing solution for urea-formaldehyde resin; The paper base is immersed in the urea-formaldehyde resin sizing solution, and processed into a melamine board paper through the dipping process; the melamine board paper is attached to the melamine resin board, and processed through a high-temperature pressing process into a Melamine board for PCB drilling with moisture absorption effect. Wherein, the component ratio of the urea-formaldehyde resin sizing solution in the sample is shown in Table 2.

[0033] Table 2 Sizing resin composition ratio

[0034] test group Urea-formaldehyde resin / g Curing agent / g Emulsifying wax / g Amino organic compound / g Emulsifier / g 1 100 0.3 5 0.08g melamine...

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Abstract

The invention discloses a melamine plate for drilling a PCB (Printed Circuit Board), and a preparation method thereof. The melamine plate for drilling the PCB comprises a melamine resin plate and melamine plate surface paper, wherein the melamine plate surface paper is attached on the melamine resin plate, the melamine plate surface paper is formed by dipping base paper into emulsifying wax-containing urea-formaldehyde resin; and the additive amount of the emulsifying wax is 3-12% of the urea-formaldehyde resin. The emulsifying wax is demulsified under the influence of external environment condition, and a wax film is formed on the base paper, so that the melamine plate for drilling the PCB has a damp-resistant function. According to the melamine plate for drilling the PCB, the problem that the surface of the melamine plate for drilling the PCB is easily moistened so as to be warped in the storage and use processes.

Description

technical field [0001] The invention relates to the field of preparation of backing plates for PCB drilling, in particular to a melamine board for PCB drilling and a preparation method thereof. Background technique [0002] Most existing manufacturers of melamine boards for PCB drilling generally use water-soluble urea-formaldehyde resin sizing paper as the face paper of melamine boards for PCB drilling, and lay the water-soluble urea-formaldehyde resin sizing paper on dense Pressed on amine resin board substrate. Since urea-formaldehyde resin contains hydrophilic groups, the melamine board for PCB drilling is easy to absorb moisture during storage and use, resulting in large warpage and poor flatness of the melamine board for PCB drilling. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention [0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a melamine ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B29/06B32B27/10B32B27/42B32B38/08B32B37/06B32B37/10
Inventor 孙志祥谢仲华杨柳张伦强邱波
Owner HUNAN LIUXIN ELECTRONICS NEW MATERIAL
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