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Semiconductor substrate dicing device and semiconductor wafer dicing manufacturing method

A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems affecting product yield and other issues

Active Publication Date: 2016-04-20
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the design of the cutting process device and the cutting process method often affect the yield of the product.

Method used

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  • Semiconductor substrate dicing device and semiconductor wafer dicing manufacturing method
  • Semiconductor substrate dicing device and semiconductor wafer dicing manufacturing method
  • Semiconductor substrate dicing device and semiconductor wafer dicing manufacturing method

Examples

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Embodiment Construction

[0014] Please refer to figure 1 , Which illustrates a semiconductor wafer cutting device in a manufacturing method according to an embodiment. The semiconductor substrate 102 has a surface 104. Several dies 106 separated from each other are arranged on the surface 104 of the semiconductor substrate 102 and located between the semiconductor substrate 102 and the carrier 108. In one embodiment, the carrier 108 is, but is not limited to, a film frame, which may include an adhesive tape 112 supported by the frame 110.

[0015] In an embodiment, the supporting element 114 fills the void 116 in the area on the surface 104 of the semiconductor substrate 102 where the die 106 is not provided. The position of the gap 116 may correspond to (including) the cutting lane. Therefore, in the step of dicing the semiconductor substrate 102, the semiconductor substrate 102 and the die 106 on it can be firmly fixed on the dicing tape 112 without shaking and abrasion to the dicing knife, and also ...

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PUM

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Abstract

The invention provides a semiconductor substrate cutting device and a manufacturing method of a semiconductor wafer cutter. The manufacturing method comprises following steps that a semiconductor substrate with a surface is provided, the surface of the semiconductor substrate is provided with a plurality of crystalline grains which are mutually separated, a plurality of gaps are formed between the crystalline grains and the surface of the semiconductor substrate, sheets are cut to form support elements, and one sides of the support elements are attached to the surface of the semiconductor substrate and fill the gaps.

Description

Technical field [0001] The invention relates to a semiconductor wafer cutting device and a semiconductor wafer cutting manufacturing method, and more particularly to a semiconductor substrate cutting manufacturing method that uses pattern glue to fill gaps. Background technique [0002] A dicing process is required in the manufacturing process of the semiconductor device. The dicing process often requires the use of a dicing knife to divide a wafer into multiple dies. The design of the cutting process device and the cutting process method often affect the yield of the product. Summary of the invention [0003] The invention relates to a semiconductor wafer cutting device and a semiconductor wafer cutting manufacturing method. In one embodiment, the semiconductor substrate and the crystal grains on it can be stabilized on a carrier, and the cutting process will not shake and improve the product yield. . [0004] According to the present invention, a manufacturing method for cutting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304H01L21/683
Inventor 萧伟民
Owner ADVANCED SEMICON ENG INC
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