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Method of molding integrated circuits

A molding and mold technology, applied in the field of molded integrated circuits, can solve problems such as cracking of thin wafers and high warpage of molded packages

Active Publication Date: 2015-11-18
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Stress can cause thin wafers to crack
Additionally, air bubbles can also lead to higher levels of warpage in molded packages

Method used

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  • Method of molding integrated circuits
  • Method of molding integrated circuits
  • Method of molding integrated circuits

Examples

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Embodiment Construction

[0030] The making and using of embodiments of the invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable inventive concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are illustrative only, and do not limit the scope of the invention.

[0031] According to various exemplary embodiments, a multi-temperature molding process is provided. Intermediate stages of the molding process are shown. Variations of the embodiments are discussed. Like reference numerals are used to designate like elements throughout the various drawings and throughout the illustrative embodiments.

[0032] Figure 1 to Figure 3 A cross-sectional view of an intermediate stage of molding the package component 20 is shown according to some example embodiments. Package component 20 includes package component 26 bonded to package component 22 . In some embodiments, package component 22 is...

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Abstract

The invention provides a method which includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature. The invention also provides methods for molding integrated circuits.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to the following provisionally filed US Patent Application Serial No. 61 / 598,567, entitled "Method for Molding Process," filed February 14, 2012, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates generally to the field of semiconductor technology and, more particularly, to methods of molding integrated circuits. Background technique [0004] Molding is a technique commonly used to protect integrated circuit devices from external environmental damage. In a typical molding process, a molding compound is spread over the device to be molded. Molds are used to confine and shape molding compounds. The molding compound is then cured and solidified, followed by moving the mold away from the molding compound. [0005] When molding large integrated circuit components, such as wafers, air bubbles can become trapped in the m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C43/18B29C43/36B29C43/52
Inventor 陈志壕刘献文蔡宜霖洪瑞斌林俊成
Owner TAIWAN SEMICON MFG CO LTD
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