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clamping device

A clamping and clamping force technology, used in cooling/ventilation/heating retrofits, etc., which can solve problems such as increasing noise levels and increasing installation costs

Inactive Publication Date: 2017-08-18
NIDEC CONTROL TECHN LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, fans require a reasonable amount of space within the device, use a relatively large amount of power, add to the cost of the device and increase the noise level produced by the device

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] now refer to Figures 1 to 6 The electric component heat conduction clamping device according to the first embodiment of the present invention will be explained.

[0041] The thermally conductive clamp 100 is arranged for use in an electronic system. The clamping device 100 is an injection molded polycarbonate structure arranged to connect to a FET (Field Effect Transistor) 200 and a diode 300 via connection elements 101 , 102 , 103 , 104 , 105 and to clamp the FET 200 and diode 300 to the electronic system via an external connector 107 . A die-cast aluminum frame 500 acts as an external heat sink. Accordingly, heat generated by the electronic components 200 , 300 is conducted to the frame 500 and then dissipated by the frame 500 . Because the frame 500 is external to the electronic circuitry of the system, heat generated by the electronic components 200, 300 dissipates away from the electronic circuitry of the system.

[0042] The configuration of the clamping devic...

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PUM

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Abstract

The present invention discloses a clamping device 100 for clamping an electrical or electronic component 200 , 300 to a heat sink 500 . The device comprises a body having a clamping surface arranged to abut the electrical or electronic component 200, 300 and a clamping arrangement 107 arranged to receive the clamping surface for pushing the body towards the heat sink to The clamping force clamps the electrical or electronic component between the body and the heat sink 500 .

Description

technical field [0001] The invention relates to the field of heat dissipation of electrical and electronic components. More specifically, but not exclusively, embodiments of the present invention relate to devices that help conduct heat from electrical or electronic components so that the heat can be dissipated away from the electrical or electronic components. Background technique [0002] It is well known that heat is often dissipated as a by-product of the electrical operation of electrical and electronic components. Furthermore, the electrical and electronic components have a certain operating temperature, so preferably some form of thermal management is employed within the electronic device to ensure that the heat dissipated by the electrical or electronic components does not lead to overheating. [0003] One way to keep electrical and electronic components from overheating is to use a heat sink. A heat sink is a heat conducting element arranged to be connected to an ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 特罗伊·温桑德乔纳森·霍尔曼阿尔特·科隆博
Owner NIDEC CONTROL TECHN LTD