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Working apparatus for component or board, and component mounting device

A technology for operating devices and substrates, applied in the direction of electrical components, electrical components, etc., can solve the problems that the component suction nozzle cannot be moved to the component installation position, and it is difficult to grasp the offset of the component suction nozzle, so as to achieve the effect of good precision

Active Publication Date: 2013-11-13
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for example, in a component mounting head in which the component nozzle is deviated from a straight line passing through the centers of the two cameras, it is difficult to grasp the amount of displacement of the component nozzle by applying the above method as it is.
Therefore, in the structure of Japanese Patent Application Laid-Open No. 2005-347555, there is a problem that, in the case of a component mounting head in which no component suction nozzle (working mechanism part) is arranged on a straight line passing between the centers of the imaging parts, the accuracy cannot be improved. Move the component suction nozzle (operating mechanism part) to the component mounting position (working position)

Method used

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  • Working apparatus for component or board, and component mounting device
  • Working apparatus for component or board, and component mounting device
  • Working apparatus for component or board, and component mounting device

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Embodiment Construction

[0037] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0038] First, refer to Figure 1 to Figure 7 , the structure of the surface mounter 100 according to one embodiment of the present invention will be described. In addition, the surface mounter 100 is an example of the "component or board working device" and the "component mounting device" of the present invention.

[0039] A surface mounter 100 according to an embodiment of the present invention is as figure 1 and figure 2 Shown is a device in which electronic components 2 are mounted on a printed circuit board (wiring board) 1 . Surface mount machine 100 as figure 1 It is shown that it includes: a base 4, a substrate transfer unit 10 provided on the base 4 (the front side of the paper), a head unit 20 that can move along the X-Y plane (paper) above the substrate transfer unit 10, and a head unit 20 capable of The support portion 30 that supports the head unit 20 to move i...

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PUM

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Abstract

This working apparatus (100) for a component or a board includes a head unit (20) and a control portion (71). The control portion performs control of correcting the center position of a working mechanism portion on the basis of the first amount of movement displacement of the actual position coordinates of the center position of a first imaging portion with respect to the theoretical position coordinates of the center position of the first imaging portion, the second amount of movement displacement of the actual position coordinates of the center position of a second imaging portion with respect to the theoretical position coordinates of the center position of the second imaging portion, and the positional interrelation between the first imaging portion, the second imaging portion, and the working mechanism portion when moving the head unit.

Description

technical field [0001] The present invention relates to a component or board working device and a component mounting device, and more particularly to a component or board working device and a component mounting device including a head unit including an imaging unit. Background technique [0002] Conventionally, a component mounting device and the like including a head unit including an imaging unit are known. For example, JP 2005-347555 A discloses such a component mounting device. [0003] Japanese Patent Laid-Open No. 2005-347555 discloses a component mounting device that includes two cameras (imaging units) and a component suction nozzle (working mechanism unit) arranged between the cameras, which can move onto a substrate. Component mounting device for component mounting heads at arbitrary positions. In the component mounting head of this component mounting device, the component nozzles between the cameras are arranged on a straight line (X axis) passing through the ce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K13/08
CPCH05K13/0023H05K13/0413H05K13/041H05K13/0812H05K13/089Y10T29/53022H05K13/00
Inventor 铃木康弘鸟井政德
Owner YAMAHA MOTOR CO LTD