Head for element moving, nozzle for element adhering and element mounting device
A head and component technology, which is applied in the field of component installation devices, can solve the problems of irregular inclination of the main body of the suction nozzle head, can not be ignored, and obstruction of the suction nozzle loading and unloading operation, and achieves the effect of stabilizing the position of the suction nozzle.
Active Publication Date: 2014-02-12
YAMAHA MOTOR CO LTD
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Problems solved by technology
Therefore, although the position of the suction nozzle (especially the position at the far end of the suction nozzle) is positioned to a certain extent based on the elastic force of the above-mentioned locking piece, it cannot be said to be completely stable, and irregularities of the suction nozzle relative to the head body will occur. tilt etc.
[0005] However, as the miniaturization of components has progressed in recent years, such irregular suction nozzle inclinations, etc. have become impossible to ignore for ensuring the mounting accuracy of components.
In addition, as a measure to suppress the irregular inclination of the suction nozzle, for example, it is conceivable to increase the positioning accuracy of the suction nozzle by strengthening the elastic force of the locking piece, but in this case, there is a possibility that the smooth attachment and detachment of the suction nozzle may be hindered. , thereby having concerns affecting takt time
Method used
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[0019] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings.
[0020] figure 1 and figure 2 A schematic diagram of a component mounting device M (a component mounting device to which the component transfer head and the component suction nozzle according to the present invention are applied) according to the present invention is shown, figure 1 for top view, figure 2 It is a front view and schematically shows a component mounting device M respectively. In addition, in figure 1 and figure 2 In , XYZ rectangular coordinate axes are shown in order to clarify the directional relationship in each figure.
[0021] The component mounting apparatus M includes a base 1, a substrate transport mechanism 2 provided on the base 1 to transport a substrate 3 such as a printed wiring board (PWB) in the X direction, component supply parts 4, 5, and component mounting parts. The head unit 6, the head unit drive mechanism...
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The invention relates to a head for element moving, a nozzle for element adhering and an element mounting device. The head for element moving comprises a shaft-shaped head body. The nozzle for element adhering can be detachably mounted at the far-end part of the head body. A clamping component enables the nozzle for element adhering to be clamped at the head body. The nozzle for element adhering comprises a mounting hole part, and the nozzle for element adhering is deposed at the head body in a manner that the far-end part of the head body is inserted in the hole part. The head body is composed of a negative pressure path and a branch path, wherein the negative pressure path is used for supplying the negative pressure for element adhering to the nozzle for element adhering, and the branch path is branched from the negative pressure path and opens at the position where the side face of the head body is opposite to the inner side face of the mounting hole part. Accordingly, the stability of the nozzle can be realized and the disassembling of the nozzle cannot be inhibited.
Description
technical field [0001] The present invention relates to a component transport head mounted on a component mounting device, etc., a component suction nozzle used for the component transport head, and a component mounting device including the component transport head. Background technique [0002] Conventionally, there is known a component mounting device which has a head for component transfer, and the head can move within a range between a substrate such as a printed wiring board positioned at a designated work position and a component supply section, Components are sucked and mounted on the board from the component supply department. The head of this kind of component mounting device includes a shaft-shaped head body and a suction nozzle for absorbing components detachably mounted on the distal end (lower end) of the head body, and the nozzles are replaced according to the type of components. The suction nozzle described above (for example, Japanese Patent Laid-Open Public...
Claims
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IPC IPC(8): H05K13/02H05K13/04
Inventor 内海智仁
Owner YAMAHA MOTOR CO LTD