Component transfer head, component suction nozzle, and component mounting device
A head and component technology, which is applied in the field of component installation devices, can solve the problems of irregular inclination of the main body of the suction nozzle head, affecting the takt time, and obstruction of the loading and unloading operation of the suction nozzle, and achieves the effect of stabilizing the position of the suction nozzle.
Active Publication Date: 2016-08-31
YAMAHA MOTOR CO LTD
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Problems solved by technology
Therefore, although the position of the suction nozzle (especially the position at the far end of the suction nozzle) is positioned to a certain extent based on the elastic force of the above-mentioned locking piece, it cannot be said to be completely stable, and irregularities of the suction nozzle relative to the head body will occur. tilt etc.
[0005] However, as the miniaturization of components has progressed in recent years, such irregular suction nozzle inclinations, etc. have become impossible to ignore for ensuring the mounting accuracy of components.
In addition, as a measure to suppress the irregular inclination of the suction nozzle, for example, it is conceivable to increase the positioning accuracy of the suction nozzle by strengthening the elastic force of the locking piece, but in this case, there is a possibility that the smooth attachment and detachment of the suction nozzle may be hindered. , thereby having concerns affecting takt time
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[0019] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings.
[0020] figure 1 and figure 2 A schematic diagram of a component mounting device M (a component mounting device to which the component transfer head and the component suction nozzle according to the present invention are applied) according to the present invention is shown, figure 1 for top view, figure 2 It is a front view and schematically shows a component mounting device M respectively. In addition, in figure 1 and figure 2 In , XYZ rectangular coordinate axes are shown in order to clarify the directional relationship in each figure.
[0021] The component mounting apparatus M includes a base 1, a substrate transport mechanism 2 provided on the base 1 to transport a substrate 3 such as a printed wiring board (PWB) in the X direction, component supply parts 4, 5, and component mounting parts. The head unit 6, the head unit drive mechanism...
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The present invention relates to a component transport head, a component suction nozzle, and a component mounting device. The component transport head includes: a shaft-shaped head body; and a component suction nozzle detachably attached to the head. The distal part of the main body; a locking member for locking the suction nozzle for absorbing the component mounted on the distal end to the main body of the head; wherein the suction nozzle for absorbing the component has a hole for mounting The suction nozzle for absorbing components is attached to the head main body based on the insertion of the distal end portion of the head main body into the mounting hole, the head main body has a negative pressure passage and a branch passage inside, The negative pressure passage is for supplying a negative pressure for absorbing components to the nozzle for absorbing components, the branch passage is branched from the negative pressure passage and is connected to the mount in the side surface of the head main body. Open at the position where the inner surface of the hole faces. Thereby, it is possible to stabilize the position of the suction nozzle without hindering the attaching and detaching performance of the suction nozzle.
Description
technical field [0001] The present invention relates to a component transport head mounted on a component mounting device, etc., a component suction nozzle used for the component transport head, and a component mounting device including the component transport head. Background technique [0002] Conventionally, there is known a component mounting device which has a head for component transfer, and the head can move within a range between a substrate such as a printed wiring board positioned at a designated work position and a component supply section, Components are sucked and mounted on the board from the component supply department. The head of this kind of component mounting device includes a shaft-shaped head body and a suction nozzle for absorbing components detachably mounted on the distal end (lower end) of the head body, and the nozzles are replaced according to the type of components. The suction nozzle described above (for example, Japanese Patent Laid-Open Public...
Claims
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IPC IPC(8): H05K13/02H05K13/04
Inventor 内海智仁
Owner YAMAHA MOTOR CO LTD