Heat-welding adhesive

A hot-melt adhesive, common technology, used in adhesives, non-polymer adhesive additives, non-polymer organic compound adhesives, etc. Good hot melt effect

Inactive Publication Date: 2014-03-26
王俊杰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, there are many kinds of adhesives available. Hot-melt adhesives are used after heat

Method used

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Examples

Experimental program
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Example Embodiment

[0006] The detailed content of the present invention is described in conjunction with the embodiments:

[0007] A hot-melt adhesive, including common polyurethane and polystyrene components, characterized in that it also includes the following components, calculated in parts by mass as follows: 5-15 parts of acrylic resin, 6-10 parts of silica , 6-15 parts of acrylic acid, 12-20 parts of potassium hydroxide.

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PUM

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Abstract

The invention provides a heat-welding adhesive. The heat-welding adhesive comprises common polyurethane and polystyrene, and is characterized by also comprising the following components in parts by weight: 5 to 15 parts of acrylic resin, 6 to 10 parts of silicon dioxide, 6 to 15 parts of acrylic acid, and 12 to 20 parts of potassium hydroxide. The heat-welding adhesive has the advantage that acrylic resin, silicon dioxide, acrylic acid and potassium hydroxide are added to make the adhesive have a very good heat-welding property.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a hot-melt adhesive. Background technique [0002] At present, there are many kinds of adhesives available. Hot-melt adhesives are used after heating to melt the adhesive, which is a kind of solid adhesive. The effect of existing hot-melt adhesives is general. Contents of the invention [0003] The technical problem to be solved is to overcome the defects in the prior art and provide a hot-melt adhesive. [0004] The technical solution adopted in the present invention is a hot-melt adhesive, including common polyurethane and polystyrene components, characterized in that: it also includes the following components, calculated as follows in parts by mass: acrylic resin 5-15 6-10 parts of silica, 6-15 parts of acrylic acid, 12-20 parts of potassium hydroxide. [0005] Compared with the prior art, the present invention has the beneficial effects that: the present invention makes...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J4/06C09J11/04
Inventor 王俊杰
Owner 王俊杰
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