Single-face skiving machine for pin of inductance coil

Abstract

The invention relates to a single-face skiving machine for a pin of an inductance coil, belonging to the technical field of inductance coil production equipment. The single-face skiving machine structurally comprises a base, an inductance coil placement clamping mold, a skiving mechanism and an electrical control system, wherein the inductance coil placement clamping mold is mounted on a side pillar on the left side of the base; the skiving mechanism comprises a machine seat, a big vehicle frame, a small vehicle frame and two milling cutter motors; the machine seat is fixed above the right end of the base; the big vehicle frame is in relative sliding connection with the machine seat through a horizontal sliding rail; two horizontal stretching crossbeams are arranged at the middle lower part of the left side of a vertical plate of the small vehicle frame, each milling cutter motor with a main shaft provided with a milling cutter is arranged above each horizontal stretching crossbeam, and a vertical sliding rail is arranged on the right side of the vertical plate and is in sliding connection with upper and lower chutes of an upright post part of the big vehicle frame. The single-face skiving machine is high in automation degree, smart in structural design, easy to operate and high in working efficiency and can be used for skiving single surfaces of pins of different inductance coils without damaging matrixes of the pins, and the surface is smooth and clean.

Description

technical field [0001] The invention relates to a single-sided thinning machine for inductance coil pins, which belongs to the technical field of inductance coil production equipment. Background technique [0002] With the development of electronic technology, surface mount or surface mount (SMT) technology has been widely used. In order to mount non-lead or short lead surface mount components on the surface of printed circuit boards or other substrates, surface mount is required. Components such as inductance coils need to be tinned before soldering. However, if the pins are too thick after tinning, the height of short-lead surface mount components will be increased and the space will be occupied. [0003] In order to reduce the duty cycle of short-lead surface mount components after the pins are tinned, the prior art is to manually control and thin one side of the pins. For example: On May 23, 2012, China Utility Model Authorization Announcement No. CN 202231362 U disclo...

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Problems solved by technology

For example: On May 23, 2012, China Utility Model Authorization Announcement No. CN 202231362 U disclosed a planer for stripping electromagnetic wire insulation. Although the planer for stripping insulation is equipped with a ratchet mechanism and a limit nut , but it is still operated by workers, and the labor intensity of workers is high. With the increase of the number of labor, the workers are more tired and the work efficiency decreases; in addition, the manual control of thinning depends on the operator's own control, which will cause the quality of the product to vary, and the inductance Coil damage rate is high, reducing the qualified rate of products

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