Panel heat pipe with embedded porous wick and manufacturing method thereof

Abstract

The invention provides a panel heat pipe with an embedded porous wick and a manufacturing method thereof. The panel heat pipe comprises an upper metal cover plate, a lower metal cover plate, and a closed cavity is formed between the upper metal cover plate and the lower metal cover plate in a welded and sealed mode. The cavity is filled with liquid working media. The inner surface of the cavity is divided into an evaporation face and a condensation face. The condensation face and the evaporation face are paved with a thin-layer porous wick structure formed by sintering metal powder particles. Sintering porous columns with inner grooves which are distributed in an array mode are machined on the evaporation face. Porous protrusions matched with the inner grooves are machined in the condensation face. The sintering porous columns and the porous protrusions are in close fit to form an embedded porous structure column. A working medium backflow channel is formed in the embedded porous structure column. According to the panel heat pipe, the capillary pressure is improved, the working medium backflow speed is remarkably increased, vapor-liquid two-phase separation is achieved, and the heat transfer performance is greatly improved; meanwhile, the embedded wick plays a supporting column role, and panel heat pipe inward sinking or crack deformation or other problems are effectively avoided.

Description

technical field [0001] The invention relates to a flat heat pipe with a nested porous liquid-absorbing core and a manufacturing method thereof. Background technique [0002] With the advancement of technology, electronic devices are developing in the direction of high power and small size. But the ensuing problem is that due to the continuous improvement of heat flux, the performance, reliability and safety of integrated circuits and semiconductor devices are greatly affected. The use of high-efficiency heat dissipation devices to achieve effective thermal control of high heat flux devices has become the key to reliable operation of various electronic devices. [0003] As a heat pipe technology used to solve local high heat flux density, flat plate heat pipe has the advantages of large heating area, good temperature uniformity, effective elimination of local hot spots, and easy integration with optoelectronic devices. It has broad prospects. It is composed of two upper and...

AI Technical Summary

Problems solved by technology

However, the filling support structure and the porous capillary structure of the upper and lower plates are not integrally formed. There are problems such as long return path of working fluid, complicated manufacturing process, and high cost, which will easily lead to deterioration of the overall heat transfer performance of the flat heat pipe.

Images