A flat heat pipe with multi-channel sintered support structure and its manufacturing method

Abstract

The invention discloses a flat heat pipe with a multi-channel sintered supporting structure and a manufacturing method thereof. The flat heat pipe comprises an upper metal cover plate and a lower metal cover plate, wherein a sealed cavity is formed between the upper metal cover plate and the lower metal cover plate through welding sealing; the cavity is filled with a liquid working medium; the inner surface of the cavity is divided into an evaporation surface and a condensation surface; thin-layer porous liquid absorption core structures formed through sintering metal powder particles are laid on the evaporation surface and the condensation surface; support pillars arranged in an array are formed on the evaporation surface through sintering; cylindrical holes which are matched with cylindrical bosses at the top ends of the support pillars are processed in the condensation surface; and the cylindrical bosses and the cylindrical holes are matched in an embedded manner to form working medium reflux channels. According to the flat heat pipe, the capillary pressure is improved, axial channels formed in the sintered support pillars provide the good working medium reflux channels, the liquid reflux resistance is reduced, the working medium reflux speed is remarkably increased, the separation of gas and liquid phases is achieved, the heat transfer performance is improved, and the support pillars can effectively prevent the problems that the flat heat pipe collapses and deforms, and the like.

Description

technical field [0001] The invention relates to a flat heat pipe with a multi-channel sintered support structure and a manufacturing method thereof. Background technique [0002] With the development of science and technology, electronic products continue to develop in the direction of high power, small size, high-density packaging and multi-function. Due to the continuous improvement of heat flux, the performance, reliability and safety of integrated circuits and semiconductor devices are facing serious heat dissipation problems. Taking high-power LED as an example, if the heat generated by the LED chip cannot be transferred in time, it will greatly affect its luminous efficiency, and even lead to its failure in severe cases. Traditional cooling and heat dissipation methods are difficult to meet the requirements of further development of electronic products, and gas-liquid phase transition has become the current and future choice of heat dissipation methods in the electron...

AI Technical Summary

Problems solved by technology

However, there are problems such as long return path of working fluid, high return penetration resistance, complicated manufacturing process, and high cost, which will easily lead to the deterioration of the overall heat transfer performance of the flat heat pipe.

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