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51results about How to "Shorten return path" patented technology

Panel heat pipe with embedded porous wick and manufacturing method thereof

The invention provides a panel heat pipe with an embedded porous wick and a manufacturing method thereof. The panel heat pipe comprises an upper metal cover plate, a lower metal cover plate, and a closed cavity is formed between the upper metal cover plate and the lower metal cover plate in a welded and sealed mode. The cavity is filled with liquid working media. The inner surface of the cavity is divided into an evaporation face and a condensation face. The condensation face and the evaporation face are paved with a thin-layer porous wick structure formed by sintering metal powder particles. Sintering porous columns with inner grooves which are distributed in an array mode are machined on the evaporation face. Porous protrusions matched with the inner grooves are machined in the condensation face. The sintering porous columns and the porous protrusions are in close fit to form an embedded porous structure column. A working medium backflow channel is formed in the embedded porous structure column. According to the panel heat pipe, the capillary pressure is improved, the working medium backflow speed is remarkably increased, vapor-liquid two-phase separation is achieved, and the heat transfer performance is greatly improved; meanwhile, the embedded wick plays a supporting column role, and panel heat pipe inward sinking or crack deformation or other problems are effectively avoided.
Owner:XIAMEN UNIV

Temperature averaging device of steam chamber heat pipe/microchannel cold plate composite structure

The invention discloses a temperature averaging device of a steam chamber heat pipe / microchannel cold plate composite structure. The device comprises a metal shell, steam cavity heat pipe layers and a microchannel cold plate layer, wherein the microchannel cold plate layer is located between the two steam cavity heat pipe layers, and the steam cavity heat pipe layers and the microchannel cold plate layer are all located in the metal shell. The liquid working medium phase-change heat exchange method is adopted for the device to transmit a large amount of heat in a gasified latent heat mode, and therefore the heat exchange capacity is remarkably improved. Because only one face of an existing steam cavity heat pipe is an evaporating face and is small in area, the utilization area of the whole is limited. The upper face and the lower face of the temperature averaging device of the composite structure are both evaporating faces, therefore, electronic components with high heating flux can be distributed on both the whole surface of the upper face and the whole surface of the lower face, the utilization rate is obviously improved, and the temperature averaging device of the composite structure can meet the thermal control requirements of the electronic components with high heating flux in the electronic industry field better. The temperature averaging device of the steam chamber heat pipe / microchannel cold plate composite structure is smaller in height, the height of a single microchannel cold plate layer in the prior art is 9mm, but the overall height of the temperature averaging device of the steam chamber heat pipe / microchannel cold plate composite structure is not larger than 9 mm.
Owner:NANJING UNIV OF SCI & TECH

Liquid absorbing core and supporting column integrated structure flat plate heat pipe based on carbon nano tube array

The invention discloses a carbon nanotube array-based liquid-absorbing core support column integral structure flat heat pipe, including upper and lower metal cover plates and upper and lower metal cover plate liquid-absorbing cores formed on the inner sides of the upper and lower metal cover plates respectively The support column is an integrated structure; the upper and lower metal cover plates are sealed to form an airtight cavity by edge sealing, and the airtight cavity after vacuuming is filled with working liquid; the upper and lower metal cover plate liquid-absorbing core support column The integrated structure includes thin-layer carbon nanotubes grown on the inner surface of the metal cover plate and several vertical carbon nanotubes that continue to grow in specific regions of the thin-layer carbon nanotubes, which respectively constitute the capillary core of the flat heat pipe and the support column of the flat heat pipe ; The upper and lower metal cover support columns are staggered to form an integrated structure of liquid-absorbing core support columns in the form of fork rows. The invention has the characteristics of high thermal conductivity, small size, light weight, etc., can not only ensure the heat transfer performance of the flat heat pipe, but also achieve the mechanical strength and safety of the heat pipe during operation.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Composite liquid-cooling heat pipe radiator

The invention belongs to the technical field of heat transfer, and particularly relates to a composite liquid-cooling heat pipe radiator. The composite liquid-cooling heat pipe radiator comprises a flat plate heat pipe, wherein heat generated by a heating component is transferred to a bottom plate of the flat plate heat pipe, a top plate of the flat plate heat pipe is provided with protrusions perpendicular to the bottom plate of the flat plate heat pipe, the protrusions form a tubular heat pipe, and an inner cavity of the flat plate heat pipe is communicated with an inner cavity of the tubular heat pipe. The composite liquid-cooling heat pipe radiator further comprises a shell. The flat plate heat pipe and the tubular heat pipe are both located in the shell, and the bottom plate of the flat heat pipe is attached to the bottom surface of the shell in a sealed mode; an area defined by the outer surface of the flat plate heat pipe, the outer surface of the tubular heat pipe and the innerwall of the shell forms a cooling liquid channel; and the shell is provided with a cooling liquid inlet and a cooling liquid outlet. According to the radiator, the tubular heat pipe is combined withthe flat plate heat pipe, so that the radiator can be attached to a flat surface of the heating component and has a good radiating effect; and meanwhile, heat released by a refrigerant of a condensation section is taken away through liquid cooling, and compared with air convection heat dissipation, the heat exchange capacity of the composite heat pipe with the outside is improved.
Owner:ZHEJIANG UNIV

Circuit board of power amplifier and manufacturing method of circuit board

An embodiment of the invention discloses a circuit board of a power amplifier and a manufacturing method of the circuit board. The circuit board comprises a substrate, an insulation dielectric layer, a PCB (printed circuit board), blind holes and a sunken type groove, wherein a groove is formed in the substrate; a surface treatment layer subjected to roughening treatment is arranged on the upper surface of the substrate; the insulation media layer is arranged in the groove, and the surface treatment layer is covered with the insulation dielectric layer ; the PCB comprises at least one core plate; conducting layers are arranged on two sides of each core plate; the PCB is arranged on the insulation dielectric layer and is connected with the insulation dielectric layer through the bottom core plate of the PCB and the conducting layer on the lower side of the bottom core plate; the blind holes are formed between the top conducting layer and the substrate or among other conducting layers besides the top conducting layer in the PCB; conducting materials are arranged on the inner walls of the blind holes; the top conducting layer of the PCB is in signal connection with the substrate or other conducting layers besides the top conducting layer through the blind holes; and the sunken type groove is formed between the top conducting layer of the PCB and the substrate, and the bottom of the sunken type groove is located in the substrate.
Owner:HUAWEI TECH CO LTD

Steam chamber heat pipe/microchannel cold plate composite structure temperature equalization device

The invention discloses a temperature averaging device of a steam chamber heat pipe / microchannel cold plate composite structure. The device comprises a metal shell, steam cavity heat pipe layers and a microchannel cold plate layer, wherein the microchannel cold plate layer is located between the two steam cavity heat pipe layers, and the steam cavity heat pipe layers and the microchannel cold plate layer are all located in the metal shell. The liquid working medium phase-change heat exchange method is adopted for the device to transmit a large amount of heat in a gasified latent heat mode, and therefore the heat exchange capacity is remarkably improved. Because only one face of an existing steam cavity heat pipe is an evaporating face and is small in area, the utilization area of the whole is limited. The upper face and the lower face of the temperature averaging device of the composite structure are both evaporating faces, therefore, electronic components with high heating flux can be distributed on both the whole surface of the upper face and the whole surface of the lower face, the utilization rate is obviously improved, and the temperature averaging device of the composite structure can meet the thermal control requirements of the electronic components with high heating flux in the electronic industry field better. The temperature averaging device of the steam chamber heat pipe / microchannel cold plate composite structure is smaller in height, the height of a single microchannel cold plate layer in the prior art is 9mm, but the overall height of the temperature averaging device of the steam chamber heat pipe / microchannel cold plate composite structure is not larger than 9 mm.
Owner:NANJING UNIV OF SCI & TECH

High speed differential signal connector

The invention discloses a high speed differential signal connector. The high speed differential signal connector includes a male end connector and a female end connector that are in mutual plug fit; the female end connector includes a female end base and a plurality of female end signal transmission modules that are plugged in parallel on the female end base; each of the female end signal transmission modules includes a signal transmission module and a metal shield plate fixed on the signal transmission module; the lower end portion of the metal shield plate is provided with protruding teeth for fixing and conducting with the female end base; and convex hull structures are disposed on the female end base corresponding to the protruding teeth. In the high speed differential signal connector, the protruding teeth are disposed at the lower end portion of the metal shield plate, and at the same time, the matching convex hull structures are disposed on the female end base to facilitate fixation of the female end signal transmission modules and the metal shield plates, and at the same time, the metal shield plates can communicate with the female end base to form a relatively short backflow path, thus facilitating shortening the backflow path of a differential signal.
Owner:SICHUAN HUAFENG ENTERPRISE GRP

High-speed backboard connector

The invention relates to the field of connectors, and discloses a high-speed backboard connector. The high-speed backboard connector comprises a female end base, signal modules and a grounding piece, a containing groove is formed in the female end base, the signal modules are inserted into the containing groove side by side, the signal modules comprise the first signal module and the second signal module which are arranged adjacently, the first signal module comprises a first convex hull shielding piece and a first elastic piece shielding piece, the second signal module comprises a second convex hull shielding piece, the grounding piece is arranged between the female end base and the first signal module, and the grounding piece is in lap joint with the first convex hull shielding piece, the first elastic piece shielding piece and the second convex hull shielding piece at the same time to form a surrounding type shielding structure so as to achieve the purposes of shortening a backflow path and optimizing crosstalk. Especially for a signal module which is located at the edge of the female end base and cannot achieve effective shielding, surrounding type shielding of the signal module is achieved, the shielding effect is good, the backflow path is short, and the crosstalk influence of differential signal transmission is reduced.
Owner:SICHUAN HUAFENG ENTERPRISE GRP

Flat heat pipe with nested porous liquid-absorbing core and manufacturing method thereof

The invention provides a panel heat pipe with an embedded porous wick and a manufacturing method thereof. The panel heat pipe comprises an upper metal cover plate, a lower metal cover plate, and a closed cavity is formed between the upper metal cover plate and the lower metal cover plate in a welded and sealed mode. The cavity is filled with liquid working media. The inner surface of the cavity is divided into an evaporation face and a condensation face. The condensation face and the evaporation face are paved with a thin-layer porous wick structure formed by sintering metal powder particles. Sintering porous columns with inner grooves which are distributed in an array mode are machined on the evaporation face. Porous protrusions matched with the inner grooves are machined in the condensation face. The sintering porous columns and the porous protrusions are in close fit to form an embedded porous structure column. A working medium backflow channel is formed in the embedded porous structure column. According to the panel heat pipe, the capillary pressure is improved, the working medium backflow speed is remarkably increased, vapor-liquid two-phase separation is achieved, and the heat transfer performance is greatly improved; meanwhile, the embedded wick plays a supporting column role, and panel heat pipe inward sinking or crack deformation or other problems are effectively avoided.
Owner:XIAMEN UNIV

Backflow composite flat heat pipe

The invention discloses a backflow combined type flat plate heat pipe which comprises an evaporation end, a condensation end, a liquid filling pipe and a liquid working medium. The liquid filling pipe and the condensation end are connected with the evaporation end to form a cavity containing a liquid working medium. The capillary reflux column and the side wall wick are arranged at the evaporation end; the evaporation end is super-hydrophilic, and the condensation end is super-hydrophobic; and the liquid working medium is deionized water. According to the non-wettability of the super-hydrophobic surface and the self-driven bounce phenomenon after liquid drop fusion, when the working angle of a system is that a condensation end is above, a liquid working medium quickly returns to an evaporation end by virtue of gravity, and capillary reflux does not need to play a role; when the condensation end is at the lower part, part of the condensation working medium returns to the evaporation end in a bouncing backflow mode, and the rest of the condensation working medium returns to the evaporation end in a capillary backflow mode through the capillary backflow column and the wall surface wick; meanwhile, a steam guide structure is arranged to promote liquid drops to flow back to the center of the evaporation end. Two backflow modes are combined, the backflow space of the flat heat pipe is expanded, the backflow path is shortened, and the backflow speed is increased.
Owner:TIANJIN UNIV
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