Low-pressure injection molding approach switch and manufacturing method thereof

A technology of low-pressure injection molding and proximity switches, which is applied in the field of proximity switches and low-pressure injection molding proximity switches. It can solve the problems of product overflow, high process cost, and labor-hour consumption, so as to shorten the delivery period, save material costs and process costs, The effect of prolonging the service life

Active Publication Date: 2015-05-06
科瑞工业自动化系统(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1. The assembly of the cap and the magnetic tank consumes man-hours, and the magnetic tank is easily damaged, resulting in a high scrap rate;
[0007] 2. The cap is a hard plastic part, which has certain defects in protecting the magnetic tank. During the subsequent use of the industrial site, the sensor head is easily damaged under the action of external force, resulting in no function of the product;
[0008] 3. The cost of infusing epoxy resin is relatively high, and the drying time is as long as 24 hours. During the process, it needs to move back and forth and clamp, resulting in too high process cost;
[0009] 4. The product is prone to glue overflow, so each structural part needs to be closely matched, resulting in high cost of each structural part

Method used

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  • Low-pressure injection molding approach switch and manufacturing method thereof
  • Low-pressure injection molding approach switch and manufacturing method thereof

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Embodiment Construction

[0021] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0022] figure 1 , figure 2 , including a magnetic tank 1, a coil 2, a circuit board 3, a first coating layer 4, a second coating layer 5, a connector 6, a housing 7, and the like.

[0023] Such as figure 2 As shown, a low-voltage injection molding proximity switch in the present invention includes a tubular housing 7 and a coil 2, a magnetic tank 1, a circuit board 3 and a connector 6 arranged in the housing 7 in sequence, the coil 2, the magnetic tank 1 and the circuit board 3 is wrapped with a first coating layer 4, the outer diameter of the first coating layer 4 around the coil 2, the magnetic tank 1 and the circuit board 3 matches the inner diameter of the shell 7; the first coating layer 4 and the connector 6 and the shell 7 are filled with a second rubber coating layer 5; the first rubber coating layer 4 and the second rubber coat...

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Abstract

The invention relates to a low-pressure injection molding approach switch and a manufacturing method thereof. The low-pressure injection molding approach switch comprises a tubular shell, and a coil, a magnetic tank, a circuit board and a connecting piece which are sequentially arranged in the shell, wherein a first rubber coating layer is wrapped around the coil, the magnetic tank and the circuit board; the external diameter of the first rubber coating layer wrapped around the coil and the magnetic tank is matched with the internal diameter of the shell; the parts between the first rubber coating layer and the shell as well as between the connecting piece and the shell are filled with a second rubber coating layer; the first rubber coating layer and the second rubber coating layer are respectively made of soft polyamide. The manufacturing method of the low-pressure injection molding approach switch comprises the steps of carrying out rubber coating for a first time, pre-assembling and carrying out rubber coating for a second time. According to the approach switch, the first rubber coating layer and the second rubber coating layer are arranged in the shell, and the soft polyamide is used for low-pressure injection molding, so that the material cost and the technological cost are effectively lowered, the delivery time of products can be shortened, and the service lives of the products can be greatly prolonged.

Description

technical field [0001] The invention relates to a proximity switch in the field of industrial automation control and various other devices, in particular to a low-pressure injection molding proximity switch and a manufacturing method thereof. Background technique [0002] The proximity switch is a sensor widely used in the field of industrial automation control and various other equipment, and it is suitable for industrial sites such as elevators and automobile manufacturing. [0003] A conventional proximity switch, its structure includes a tubular shell and a magnetic tank, a coil, and a circuit board installed in the shell. The two ends of the shell are also equipped with a cap and a back cover, and the cap is used to protect the magnetic tank of the sensor head. , The cap is generally made of hard plastic. The inside of the housing is filled with epoxy resin which acts as a seal. [0004] The manufacturing process of this conventional proximity switch is as follows: Fi...

Claims

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Application Information

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IPC IPC(8): B29C45/14H01H9/02
CPCB29C45/14H01H9/02
Inventor张强
Owner科瑞工业自动化系统(苏州)有限公司