Manufacturing method of sheet type membrane fixed resistor with failure rate level

A technology of fixed resistance and manufacturing method, applied in resistance manufacturing, resistors, circuits, etc., can solve the problems of high failure rate of chip thick film resistors, can not meet the requirements of military use, low reliability, etc., to achieve stable resistance, The effect of reducing failure rate and improving production efficiency

Inactive Publication Date: 2015-06-17
蚌埠市德瑞特电阻技术有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

As a new type of component with small size and light weight, chip film fixed resistors have been widely used in military equipment. Military equipment has requirements for the quality, precision, safety, reliability and other indicators of chip resistors. Higher, different military equipment has different requirements for the failure rate level. The chip thick film resistors manufactured by the existing common method have the defects of high failure rate and low reliability, which can no longer meet the requirements of military industry.

Method used

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Embodiment Construction

[0035] The invention provides a method for manufacturing a chip film fixed resistor with a failure rate level, which includes making the back electrode, making the positive electrode, making the resistor body, primary glass encapsulation, laser adjustment of resistance, secondary glass encapsulation, thermal aging , splitting, terminal electrode production, splitting, electroplating; the specific operation steps are as follows:

[0036] 1. Put the ceramic substrate into an ultrasonic cleaning tank, clean it with deionized water for 5-10 minutes, and then dry it at 100±5°C for 25 minutes;

[0037] 2. Clean the back of the cleaned ceramic substrate with a dust roller, then print the back electrode, and then dry at 125°C for 10 minutes to ensure that the printing thickness reaches 21-31 μm after drying, preferably 25 μm;

[0038] 3. Clean the front side of the cleaned ceramic substrate with a dust roller, then print the front electrode, and then dry it at 125°C for 10 minutes to ...

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PUM

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Abstract

The invention discloses a manufacturing method of a sheet type membrane fixed resistor with a failure rate level. The manufacturing method comprises the following steps: manufacturing back electrodes, manufacturing positive electrodes, manufacturing resistor bodies, performing glass encapsulating primarily, performing laser trimming, performing glass encapsulating secondarily, performing thermal ageing, splitting strips, manufacturing end electrodes, splitting sheets and electroplating. The working procedure of cleaning rollers with dust is additionally added before printing, so that the adhesiveness of a resistive membrane layer is greatly improved, and in addition an empty phenomenon generated by membrane layers of the resistor bodies and glass glaze layers is effectively avoided; the working procedure of the thermal ageing is additionally added after printing glass frit secondarily, so that the resistance is more stable, and the failure rate is obviously reduced. Besides, the end electrodes are processed by splashing, compared with the end electrodes coated with traditional frit, the cost is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to a method for manufacturing a resistor, in particular to a method for manufacturing a chip film fixed resistor. Background technique [0002] Resistors are basic electronic components, and their quality directly affects the accuracy and reliability of electronic equipment. As a new type of component with small size and light weight, chip film fixed resistors have been widely used in military equipment. Military equipment has requirements for the quality, precision, safety, reliability and other indicators of chip resistors. Higher, different military equipment has different requirements for the failure rate level. The chip thick film resistors manufactured by the existing common method have the defects of high failure rate and low reliability, which can no longer meet the requirements of military industry. Contents of the invention [0003] Aiming at the defects in the prior art, the present invention aims to provide a manufa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C17/00
Inventor 李福喜李开锋崔艳红郑如涛
Owner 蚌埠市德瑞特电阻技术有限公司
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