Unlock instant, AI-driven research and patent intelligence for your innovation.

Method and apparatus for etching fluoropolymer substrates

A technology for fluoropolymers and substrates, applied in the direction of surface etching compositions, chemical instruments and methods, membranes, etc., can solve the problems of not allowing safe storage of etching solutions, unsatisfactory safety, etc.

Active Publication Date: 2018-06-29
谷阿尼弗朗股份公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the variant using ammonia does not allow safe storage of the etching solution, given the low boiling point of the mixture (approximately -31 °C); conversely, THF, although stable at room temperature, is extremely flammable
[0006] Even the methods proposed later proved to be considerably less than ideal from an environmental point of view or with regard to process safety

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and apparatus for etching fluoropolymer substrates
  • Method and apparatus for etching fluoropolymer substrates
  • Method and apparatus for etching fluoropolymer substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Example 1: Synthesis of viscosifying solutions.

[0066] In a container containing 200 liters, at a temperature of 50-60° C. with constant stirring, a first quantity of diethylene glycol dimethyl ether (technical titer) in an amount of about 80–180 kg and about 5 - 50 kg (eg 15-35 kg) of a second quantity of sodium naphthalene in a sodium-naphthalene ratio of 1:1 or 2:1 are mixed together. This variation in weight is mostly due to the quality of the etch or the goal to be achieved. The mixture is reacted for a period of about 1-6 hours or 2-4 hours, and then fed to an etch tank or tanks.

Embodiment 2

[0067] Example 2: Synthesis of washing solution.

[0068] The wash solution is prepared by mixing about 100 liters of water until a volume of 99.9% acetic acid solution with a pH of about 2-6, preferably 3-5, eg about 4 is obtained.

[0069] The initial concentration of acetic acid in the removal tank before starting to wash the major surfaces is essentially the same as that obtained at the end of the second reverse osmosis stage when the plant was running.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

A (semi-)continuous etching method for a fluoropolymer substrate (10), comprising the steps of feeding (22) said substrate (10) in the form of a continuous strip, wherein said substrate defines a major surface (12) , subjecting a portion of the main surface (12) to at least one etching operation (2) by means of a tackifying solution comprising an alkali metal complex in naphthalene, washing (4) by means of a washing solution (42) comprising an aqueous acetic / formic acid solution a major surface (12) wetted by the tackifying solution, and the selective separation of a concentrated solution of acetic / formic acid (24) from the wash liquor (42) by means of a reverse osmosis operation (6,8) at elevated pressure, and At least a portion of the concentrated acetic / formic acid solution (24) is reintroduced into the wash liquor (42) to establish recirculation. The invention further relates to etching equipment.

Description

technical field [0001] The present invention relates to methods and apparatus for processing fluoropolymer substrates and, in particular, to methods / apparatus for etching fluoropolymer substrates to increase the surface adhesion of such substrates. Background technique [0002] The chemical resistance of polytetrafluoroethylene (PTFE) is a feature that has made such fluoropolymers highly desirable in the chemical industry, for example for coating reactors or pipes in the presence of their naturally aggressive reactions. PTFE has replaced asbestos - now banned by law due to its carcinogenicity - in a number of applications such as eg coating high temperature cables. Furthermore, the biocompatibility of PTFE has led to its use by the biomedical industry in the manufacture of implantable components as well as in medical devices for use in the human body. The unique properties of the dielectric properties of fluoropolymers in general, and of PTFE in particular, have allowed the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/02B01D61/58B29C71/00C08J7/14C09K13/02
CPCB01D61/58C08J7/02B01D61/025B01D69/12B01D2311/06B01D2311/25B01D2311/2634B01D2311/2688C08J7/14B01D61/026B01D69/1071B01D69/1213B01D2311/263B01D2311/2669C08J2327/18
Inventor 马西莫·维拉诺帕斯夸莱·斯泰拉
Owner 谷阿尼弗朗股份公司