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Substrate clamping device

A technology of clamping device and clamping position, which is applied in the direction of assembling printed circuits, printed circuits, electrical components, etc.

Active Publication Date: 2018-04-06
FUJI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the warpage of the substrate that can be corrected by the support pins is only downward warpage (warpage downward), and upward warpage (warpage upward) cannot be corrected by support pins.

Method used

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  • Substrate clamping device
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] based on Figure 1 to Figure 6 Example 1 of the present invention will be described.

[0030] First, use figure 1 The structure of the component mounting table 11 of the component mounting machine will be described.

[0031] The component mounting table 11 is a place where components are mounted by a mounting head (not shown) of a component mounting machine on a substrate 13 conveyed in the X direction by a conveyor 12 . The conveyor 12 consists of two conveyor belts 12a (see figure 2 ) structure, by making the guide rail 14 holding a conveyor belt 12a move along its width direction (Y direction) according to the width of the substrate 13, the width of the conveyor 12 (the interval between the two conveyor belts 12a) can be adjusted according to the width of the substrate 13.

[0032] A support plate 16 on which support pins 15 (support members) are placed is horizontally provided on the component mounting table 11 . The support plate 16 is formed of magnetic mater...

Embodiment 2

[0054] In the first embodiment described above, the entire area of ​​the side edge portion of the substrate 13 is pressed by a pressing member 22, and the Figure 7 In the shown embodiment 2 of the present invention, a plurality of divided pressing members 22 are arranged along the side edge of the substrate 13, and each of them is installed so as to be independently movable to an upwarping correction position, a normal clamping position, and a substrate removal position. Press part 22 . Each of the pressing members 22 is movably attached to the upper end of the guide rail 14 by engaging the engagement pin 25 fixed to the upper end of the guide rail 14 with the engagement groove 24 as in the first embodiment described above. The other structures are also substantially the same as in the first embodiment above.

[0055]In the second embodiment described above, only the pressing member 22 corresponding to the empty space located in the side edge portion of the substrate 13 amon...

Embodiment 3

[0057] In Embodiments 1 and 2 above, the pressing member 22 is mounted on the upper end of the guide rail 14 so as to be movable to the upwarping correction position, the normal clamping position, and the substrate removal position. Figure 8 In the third embodiment of the present invention shown, according to the same structure as the above-mentioned embodiment 1, the upward warping correction pressing member 22 of the substrate 13 is clamped in a state where a downward bending moment is applied to the substrate 13, and it is not corrected. The pressing member 31 for normal clamping which clamps the board|substrate 13 under the state which applies downward bending moment to the board|substrate 13 is attached to the upper end of the guide rail 14 so that it can be interchanged with an engaging means, a screw, etc. There is no need to form an inclined surface on the lower surface of the normal clamping pressing member 31 , and the front end portion of the normal clamping pressin...

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PUM

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Abstract

A holding member 22 that holds a lateral end portion of a board 13 is attached to be movable between an upward warping correction position and a normal clamping position with respect to a guide rail 14 of a conveyor 12. When the holding member 22 is positioned at the upward warpage correction position, a distal end portion that is the lowest portion of a slope surface 23 of the holding member 22 is positioned at an inner side of the board 13 than the upper end of the lifting member 21. By nipping the lateral end of the board 13 between the distal end portion of the slope surface 23 and the upper end of the lifting member 21 in such a positional relationship, the board 13 is clamped in a state that the downward bending moment is applied to the board 13. In the normal clamping position, the distal end portion of the slope surface 23 of the holding member 22 is positioned directly above the lifting member 21. By nipping the lateral end portion of the board 13 between the distal end portion of the slope surface 23 and the upper end of the lifting member 21 in such a positional relationship, the board 13 is clamped in a state that the downward bending moment is not applied to the board 13.

Description

technical field [0001] The present invention relates to a substrate clamping device for sandwiching and clamping a side edge portion of a substrate conveyed by a conveyor between a lifting member and a pressing member located above the lifting member. Background technique [0002] For example, in a component mounting machine, generally, a substrate conveyed by a conveyor is lifted from the bottom of both sides in the width direction of the conveyor by the lifting member of the substrate clamping device, and the side edge portion of the substrate is clamped into the substrate. After clamping between the lifting part and the pressing part above the lifting part, the component is mounted on the substrate by the mounting head. In recent years, since substrates have gradually become thinner and their strength has gradually weakened, warpage is likely to occur. In addition, in order to meet the requirements of high-density mounting and miniaturization in recent years, the demand ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04H05K3/34
CPCH05K3/1225H05K13/0061
Inventor 川合英俊水野贵幸伊藤秀俊田中启太
Owner FUJI KK