Liquid crystal module with waterproof function

Abstract

The invention provides a liquid crystal module with a waterproof function. The liquid crystal module comprises a front frame, a rubber frame, a colored filter substrate, an array substrate and a COF assembly. The first side of the rubber frame is parallel to the first side of the front frame, and the second side of the rubber frame is parallel to the second side of the front frame. The array substrate is arranged between the first side of the rubber frame and the colored filter substrate, and a control circuit is further arranged on the upper surface of the array substrate. One end of the COF assembly is coupled to the control circuit, the other end of the COF assembly is coupled to a printed circuit board, and a drive chip is packaged on the surface of the COF assembly. A first guide board is arranged on the second side of the rubber frame, a second guide board is arranged on the second side of the front frame, and cleaning liquid is guided out of the module through the first guide board and the second guide board. Compared with the prior art, the guide boards abut against the inner side and the outer side of the COF assembly to change the curvature of the liquid crystal module, and therefore the cleaning liquid is effectively guided to flow out of the module, and the situation that due to the fact that the cleaning liquid is left on the surface of the COF assembly, a metal wire is corroded is avoided.

Description

technical field [0001] The invention relates to a liquid crystal module, in particular to a liquid crystal module with waterproof function. Background technique [0002] With the progress of optical technology and semiconductor technology, liquid crystal display devices (Liquid Crystal Display, LCD) have been widely used in display devices of electronic products. Today's liquid crystal display products, especially portable products, tend to be thinner, shorter, and lighter in design structure, so new materials and assembly technologies are constantly being introduced. Chip On Film (COF) technology is one of the most important assembly technologies. The term "chip-on-chip" uses a flexible circuit board as a carrier for packaging the driver chip, and the driver chip is directly mounted on the flexible circuit board. This connection method has a high degree of integration, and peripheral components can also be installed on the flexible circuit board. [0003] In the existing...

AI Technical Summary

Problems solved by technology

In addition, with the increasing demand for display quality, different module designs have been derived, and the design of placing the printed circuit board facing the ground has gradually become the mainstream of the market. However, when the user cleans the panel, the cleaning liquid is sprayed on the On the surface of the panel, due to the influence of gravity, the liquid is easy to flow down the panel and accumulate on the inside and outside of the COF component respectively, causing the metal wires inside the COF component to be corroded, affecting the quality of the display screen

In addition, the cleaning liquid may flow into the gold fingers of the printed circuit board, causing short circuits or other circuit failures

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