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Anti-dazzle LED directional lamp based on photo-thermal integrated design and implementation method thereof

A directional light and optical design technology, applied in lighting and heating equipment, semiconductor devices of light-emitting elements, light sources, etc., can solve the problems of poor heat dissipation, difficult control of illuminance uniformity in secondary light distribution design, and high energy consumption

Pending Publication Date: 2016-10-26
HENGDIAN GRP TOSPO LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, COB chips in the lighting industry at home and abroad are not cost-effective. SMD chip modules have advantages due to their high light efficiency per unit area and low price. However, due to the relative independence of a single light source chip, there will be the following technical problems in light distribution and heat dissipation design: 1. SMD chip modules have high light efficiency per unit area, so when they are densely arranged, the temperature is too high, resulting in high energy consumption and serious light attenuation; 2. It is difficult to control the uniformity of illumination in the secondary light distribution design, which makes the whole lamp dizzy 3. Poor heat dissipation

Method used

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  • Anti-dazzle LED directional lamp based on photo-thermal integrated design and implementation method thereof
  • Anti-dazzle LED directional lamp based on photo-thermal integrated design and implementation method thereof
  • Anti-dazzle LED directional lamp based on photo-thermal integrated design and implementation method thereof

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Embodiment 1

[0083] Such as Figure 1-7 As shown, an anti-glare LED directional light based on the integrated design of light and heat includes a PCB board, the PCB board is set in the shell, the reflector is connected to the PCB board, the LED substrate is set in the reflector cup, the LED substrate and the Fresnel The lens is connected, and the fly-eye lens is connected with the top of the reflective cup.

[0084] In this embodiment, the LED substrate is attached to the reflective cup, and the reflective cup is attached to the outer shell; the inner surface of the reflective cup is designed as a free-form surface; the outer shell is a heat-conducting plastic shell.

[0085] The surface of the fly-eye lens in this embodiment is a honeycomb structure after matte surface treatment; the outer edge of the Fresnel lens is provided with a hook, which buckles the bottom of the reflector cup; the edge of the fly-eye lens is provided with an inner hook, which is glued to the outer shell by glue C...

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Abstract

The invention discloses an anti-dazzle LED directional lamp based on photo-thermal integrated design. The anti-dazzle LED directional lamp comprises a PCB, wherein the PCB is arranged in a shell; a reflection cup is connected with the PCB; an LED base plate is arranged in the reflection cup and is connected with a Fresnel lens; a fly's-eye lens is connected with the top of the reflection cup. The invention further discloses an implementation method of the anti-dazzle LED directional lamp based on photo-thermal integrated design. The anti-dazzle LED directional lamp based on photo-thermal integrated design has the characteristics of simple structure, low cost, excellent uniformity, low energy consumption, less luminous decay, excellent heat dissipation and the like.

Description

technical field [0001] The invention relates to LED lamp technology, in particular to an anti-glare LED directional lamp based on an integrated design of light and heat and a realization method thereof. Background technique [0002] At present, COB chips in the lighting industry at home and abroad are not cost-effective. SMD chip modules have advantages due to their high light efficiency per unit area and low price. However, due to the relative independence of a single light source chip, there will be the following technical problems in light distribution and heat dissipation design: 1. SMD chip modules have high light efficiency per unit area, so when they are densely arranged, the temperature is too high, resulting in high energy consumption and serious light attenuation; 2. It is difficult to control the uniformity of illumination in the secondary light distribution design, which makes the whole lamp dizzy 3. Poor heat dissipation. Contents of the invention [0003] Th...

Claims

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Application Information

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IPC IPC(8): F21K9/68F21K9/69F21V7/22F21V5/04F21V29/85F21Y115/10
CPCF21V5/045F21V7/22F21V29/85
Inventor 方惊响药左红彭杰张笑杨圣别
Owner HENGDIAN GRP TOSPO LIGHTING
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