Linux-based dual-mode interconnection dual-board function test method

A functional testing, dual-board technology, applied in the field of dual-mode interconnection dual-board functional testing based on Linux, can solve problems such as quality loopholes, large testing costs, and low test coverage, achieving low cost, reduced testing time, and high efficiency. Effect

Active Publication Date: 2018-10-02
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) The test coverage rate is low, and it is easy to produce quality loopholes
[0005] (2) Single-mode substation testing increases a lot of testing costs
[0006] (3) In the production process of dual-mode interconnection function boards, the above two problems are more prominent

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Linux-based dual-mode interconnection dual-board function test method
  • Linux-based dual-mode interconnection dual-board function test method
  • Linux-based dual-mode interconnection dual-board function test method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The content of the present invention is described in more detail below:

[0026] a) Check the BIOS settings and set the board mode boot sequence.

[0027] b) Start up and enter the Linux system, and the program records the information of the board.

[0028] PN, SN, mode, etc.

[0029] c) Die splitting test under Linux and record the test, generate a test log, after the test pass, power off and change the mold, fixture assembly, plug-in wiring, etc. Such as test Fail, the engineer makes a preliminary analysis and determines whether to repair or retest. The full instructions are as follows:

[0030] Determine the Load test script and test module according to the test status flag step file, part of the code is as follows

[0031]

[0032] Generate the test log of the test step 1, the test completion flag, and generate the test completion flag of this step. Part of the code is as follows.

[0033]

[0034] d) Boot into the Linux system, compare the matching board...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a Linux-based dual-mode interconnection double-board function test method, which belongs to the field of large-scale testing of computer dual-mode interconnection board factories. The single-mode cross test is carried out, and the device information matching and log information matching are carried out, which effectively increases the test coverage and ensures the consistency of the dual-mode test boards, with high efficiency and low cost, without increasing the labor intensity of workers.

Description

technical field [0001] The invention relates to the field of large-scale testing of computer dual-mode interconnection board factories, in particular to a Linux-based dual-mode interconnection dual-board function testing method. Background technique [0002] In the current computer dual-template card test, efficiency, test coverage and test cost cannot be balanced. [0003] In the current large-scale testing of computer dual-mode function board factories, based on the particularity of product functions, test time, cost, product delivery and test coverage considerations, most of the FCT function tests of dual-mode function boards select representative The test is performed on a single-mode with high priority, high priority, and high frequency, or a single-mode substation test, and the following problems exist: [0004] (1) The test coverage rate is low, and it is easy to produce quality loopholes [0005] (2) Single-mode substation testing increases a lot of testing costs ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2803
Inventor 王新亚王佩
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products